Glass-Core Millimeter Wave Components for Compact 3D Integration

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Solution Overview

Problem

Legacy implementations of millimeter wave components in semiconductor packages result in larger footprints, higher losses, and integration challenges due to design rules and the use of magnetic materials, limiting bandwidth and area efficiency.

Innovation Solution

Laser-assisted etching techniques are used to create high aspect ratio, narrow vias and trenches in glass substrates, enabling vertical integration of millimeter wave components like resonators, couplers, and circulators, reducing footprint and insertion loss, and allowing higher bandwidth densities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If legacy implementations of millimeter wave components are used in semiconductor packages, then integration is achieved, but footprint size increases and losses increase

Engineering Contradiction:

Improveinsertion lossVSAvoidcomponent footprint

Core Design Contradiction:

Loss of energyVSArea of stationary object

Solution Approach 1:

The patent transitions from planar (2D) millimeter wave components to three-dimensional (3D) components embedded within the substrate. By utilizing vertical stacking and depth dimensions, the component footprint is reduced while maintaining or improving performance characteristics such as insertion loss and bandwidth density.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent embeds millimeter wave components within the substrate structure, nesting them inside the package rather than placing them on the surface. This nesting approach allows components to be integrated within the substrate volume, reducing overall footprint and improving area efficiency.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of manufacture

If magnetic materials are used in millimeter wave components, then component functionality is achieved, but integration difficulty increases and footprint increases

Engineering Contradiction:

Improveintegration easeVSAvoidcomponent footprint

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent changes the material parameters by replacing magnetic materials with non-magnetic materials such as glass or low-loss dielectric materials. This parameter change enables better integration with semiconductor processes, reduces footprint, and maintains millimeter wave component functionality through alternative material properties.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures, particularly glass-core substrates combined with conductive materials and low-loss dielectrics. These composite materials provide the necessary electromagnetic properties for millimeter wave components without requiring magnetic materials, thereby simplifying integration and reducing footprint.

Inventive Principle:

Principle #40Composite materials

3Productivity

If design rules are followed in legacy implementations, then manufacturing is achieved, but bandwidth density is limited and area efficiency decreases

Engineering Contradiction:

Improvebandwidth densityVSAvoidpackage area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The patent exploits the third dimension (vertical depth) to increase bandwidth density. By stacking multiple millimeter wave components and interconnects vertically within the substrate, the patent achieves higher bandwidth density without proportionally increasing the package footprint, thereby improving area efficiency.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Device complexity

If through silicon via (TSV) technology is used, then 3-D integration is achieved, but manufacturing complexity increases

Engineering Contradiction:

Improveintegration structureVSAvoidmanufacturing process

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The patent uses glass-core substrates as an alternative to silicon TSV technology. The glass core provides a low-loss medium for millimeter wave signals and simplifies the manufacturing process by eliminating the need for complex TSV formation, while still achieving 3-D integration of millimeter wave components.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces component size, improves integration, and enhances bandwidth density by minimizing impedance mismatch and coupling distances, facilitating higher data rates and lower losses in millimeter wave frequencies.

Implementation Method 1

etching a via from a first side of the glass core to a second side of the glass core

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentEP4106099B1Millimeter wave components in a glass core of a substrate

Publication Date: 2026.03.04 INTEL CORP

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Figure 3A~3C

AI summary

Embodiments described herein may be related to apparatuses, processes, and techniques related creating millimeter wave components within a glass core of a substrate within a semiconductor package. These millimeter wave components, which include resonators, isolators, directional couplers, and circulators, may be combined to form other structures such as filters or multiplexers. Other embodiments may be described and/or claimed.