Glass-Core IC Package Structure to Reduce Cracking and Separation
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Solution Overview
Problem
Glass cores in semiconductor substrate packages are prone to mechanical and thermal stress-induced cracking and separation due to CTE mismatch and tool contact, posing challenges for widespread adoption and increasing manufacturing costs.
Innovation Solution
A hybrid reconstitution process using a protective frame and reinforcement materials, such as glass cloth prepreg or resin coated copper, is employed to encapsulate glass panels, combined with low CTE epoxy materials for enhanced protection and stability during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass cores are used in semiconductor substrate packages, then mechanical rigidity and thermal properties are improved, but susceptibility to cracking and separation due to mechanical and thermal stress increases
Solution Approach 1:
The patent applies beforehand cushioning by introducing a compliant intermediate layer between the rigid glass core and the organic substrate layers. This layer acts as a stress-absorbing buffer that prevents direct transmission of mechanical and thermal stresses to the glass core, thereby preventing cracking and separation while maintaining the rigidity benefits of the glass core.
Solution Approach 2:
The patent employs composite materials by creating a multi-layer structure that combines glass core with organic substrate materials and compliant intermediate layers. This composite approach allows the system to benefit from the high rigidity and thermal stability of glass while mitigating its susceptibility to stress-induced cracking through the complementary properties of the organic and compliant layers.
2Reliability
If glass panels are protected during manufacturing, then yield is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary action by forming the compliant intermediate layer and protective framing structures before subsequent manufacturing steps that could subject the glass panels to stress. This pre-protective措施 ensures that the glass panels are shielded during critical manufacturing operations, improving yield without requiring complex in-process intervention.
Solution Approach 2:
The patent uses an intermediary compliant layer as a mediator between the glass core and the manufacturing environment. This intermediate layer absorbs and distributes mechanical stresses during handling and processing, protecting the glass panels from damage while maintaining a relatively simple manufacturing process flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces glass cracking and separation risks, improves yield, and lowers manufacturing complexity and costs by providing superior mechanical and thermal protection to glass panels.
Implementation Method 1
Glass cores in semiconductor substrate packages are prone to mechanical and thermal stress-induced cracking and separation due to CTE mismatch
Implementation Method 2
A hybrid reconstitution process using a protective frame and reinforcement materials, such as glass cloth prepreg or resin coated copper, is employed to encapsulate glass panels
Data Source
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AI summary
An apparatus comprising a package substrate, the package substrate comprising a glass layer, a first layer comprising a photo-imageable dielectric (PID) material above the glass layer, a second layer below the glass layer, the second layer comprising the PID material, at least one buildup layer above the first layer, and at least one buildup layer below the second layer.