Glass-Core Package Routing for Thin 3D Die Integration
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Solution Overview
Problem
Advanced packaging applications face challenges in properly aligning multiple bridge dies and dealing with bump thickness variation, leading to low yields due to the increasing complexity of embedded bridge architectures.
Innovation Solution
The use of a glass core enables high density routing directly on its surface, replacing embedded bridges, and allows for three-dimensional integration through silicon vias, facilitating the assembly of die tiles with reduced thickness and improved thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If embedded bridge architectures are used to couple multiple dies together, then high density routing can be achieved, but the complexity of properly aligning multiple bridge dies and dealing with bump thickness variation increases, leading to low yields
Solution Approach 1:
The patent extracts the routing function from the bridge dies and relocates it to the package substrate. By removing the need for embedded bridges and placing high density routing directly on the substrate, the alignment complexity between multiple bridge dies is eliminated while maintaining high routing density.
Solution Approach 2:
The patent transitions from three-dimensional embedded bridge structures to two-dimensional surface routing on the package substrate. This dimensional change simplifies the architecture by eliminating the need for vertical alignment and bump thickness control, reducing manufacturing complexity while achieving high density through planar routing patterns.
2Adaptability or versatility
If the number of bridge dies is increased to achieve the desired architecture, then routing flexibility improves, but yield issues become more prevalent due to alignment and bump thickness variation problems
Solution Approach 1:
The package substrate is designed to perform multiple functions: it provides the mechanical support structure, contains the high density routing patterns, and serves as the interconnection platform for all dies. This universal substrate approach replaces the need for multiple specialized bridge dies, improving yield while maintaining routing flexibility through programmable routing patterns.
Solution Approach 2:
The patent changes the fundamental parameters of the interconnection architecture by transitioning from discrete bridge die structures to integrated substrate routing. This parameter change allows routing flexibility to be achieved through design variations in the substrate routing patterns rather than through adding more bridge components, thereby improving yield.
3Length of stationary object
If traditional packaging methods are used, then assembly processes are established, but thickness reduction and thermal stability improvements are limited
Solution Approach 1:
The patent applies local quality by using glass material specifically in the package substrate where thermal stability is critical. The glass substrate provides localized thermal stability in the packaging structure while allowing overall thickness reduction, as the glass is only used where needed for thermal management rather than throughout the entire package.
Data Source
AI summary
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate, where the substrate comprises glass, and buildup layers over the first substrate. In an embodiment, a first die is over the buildup layers, a second die is over the buildup layers and adjacent to the first die, and where conductive routing in the buildup layers electrically couples the first die to the second die.