Glass Core PCB With Embedded Passive Elements
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Solution Overview
Problem
The increasing size and thickness of semiconductor packages lead to warpage issues in large-area substrates, and there is a need to reduce core thickness to accommodate smaller pitches for through-vias, while also requiring improved power efficiency and signal integrity.
Innovation Solution
A printed circuit board is designed with a glass layer as the core, featuring blind cavities of varying depths and through-cavities to embed passive elements and electronic components, thereby enhancing capacitance, reducing parasitic inductance, and minimizing power path length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the size and thickness of semiconductor packages are increased, then the substrate area is enlarged, but warpage control deteriorates
Solution Approach 1:
The substrate is divided into multiple layers including a core layer, first insulating layer, second insulating layer, and glass layer, with each layer serving specific functions. This segmentation allows independent optimization of each layer to control warpage while maintaining large substrate area for high-performance semiconductor applications.
Solution Approach 2:
The substrate employs a composite structure combining organic insulating materials (prepreg, ABF) with an inorganic glass layer. This composite material approach leverages the dimensional stability of glass to counteract warpage in large-area substrates while maintaining the electrical insulation properties of organic materials.
2Length of moving object
If the core thickness is reduced, then the through-via pitch is decreased, but the structural strength is weakened
Solution Approach 1:
The core structure combines thin organic core layers with a rigid glass layer to achieve reduced overall thickness for fine via pitch while the glass layer provides the necessary structural strength and dimensional stability that compensates for the reduced organic core thickness.
Solution Approach 2:
Different regions of the substrate have different thickness characteristics - the organic core layers are made thin to enable fine via pitch, while the glass layer provides localized structural reinforcement. This local quality differentiation allows simultaneous achievement of thin profile and structural strength.
3Use of energy by moving object
If passive elements are embedded in the substrate, then power efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
Passive elements such as capacitors are embedded within the substrate layers during the manufacturing process itself, rather than being added later. The cavities for these elements are formed and filled during the lamination and drilling processes, integrating passive element incorporation into the existing manufacturing flow to minimize additional complexity.
Solution Approach 2:
Passive elements are nested within the multi-layer substrate structure, with capacitors and other components embedded between the insulating layers. This nesting approach allows passive elements to be integrated into the substrate without significantly increasing overall device footprint or manufacturing complexity.
Data Source
AI summary
The present disclosure relates to a printed circuit board including: a glass layer; a plurality of blind cavities respectively penetrating through a portion of the glass layer from an upper surface or a lower surface of the glass layer; a plurality of passive elements respectively disposed in the plurality of blind cavities; and an insulating layer covering at least a portion of each of the glass layer and the plurality of passive elements and disposed in at least a portion of each of the plurality of blind cavities. At least two of the plurality of blind cavities have different depths.