Glass Core Interposer Insulation Layout to Prevent Layer Peeling
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Solution Overview
Problem
Existing semiconductor packages face challenges in miniaturization, multi-functionalization, and reliability, particularly when using glass interposers due to issues with adhesion and peeling of insulating layers containing fillers.
Innovation Solution
A semiconductor package design incorporating a glass core substrate with a first insulating layer free of filler, surrounded by a second insulating layer with filler, enhances adhesion and protects the glass core substrate, using a layered structure with core vias and redistribution layers to improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a glass interposer with insulating layers containing fillers is used, then the structural integrity is maintained, but adhesion problems and peeling occur
Solution Approach 1:
The insulating layer is divided into two distinct layers: a first insulating layer without filler in direct contact with the glass core substrate, and a second insulating layer with filler on top. This segmentation allows the bottom layer to provide excellent adhesion to the substrate while the top layer provides structural integrity and protection, resolving the contradiction between adhesion and structural strength.
Solution Approach 2:
Different regions of the insulating structure have different compositions optimized for their specific functions. The first insulating layer near the substrate has no filler for maximum adhesion, while the second insulating layer farther from the substrate contains filler for enhanced structural integrity. This local differentiation of material properties solves the adhesion-peeling problem while maintaining overall structural strength.
2Volume of moving object
If miniaturization is pursued, then device size is reduced, but reliability of insulating layers deteriorates
Solution Approach 1:
In miniaturized devices, the two-layer insulating structure becomes even more critical. The filler-free first layer ensures reliable adhesion in the confined space, while the filled second layer maintains structural integrity despite reduced overall dimensions. This local optimization of material composition allows miniaturization without sacrificing insulating layer reliability.
Data Source
AI summary
Provided is a semiconductor package including a glass core interposer including a glass core substrate, a plurality of through electrodes penetrating the glass core substrate, a first insulating layer at least partially covering each of an upper surface and a lower surface of the glass core substrate, a second insulating layer at least partially surrounding the first insulating layer and the glass core substrate, and an upper redistribution layer on an upper surface of the second insulating layer, and a first semiconductor device on an upper surface of the glass core interposer, wherein the first insulating layer is free of filler, and the second insulating layer includes filler.