Glass-Core PIC Packaging for Dense Electrical and Optical Routing
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Solution Overview
Problem
Current packaging technologies for photonic integrated circuits (PICs) face challenges in achieving high-density, high-bandwidth electrical communication while simultaneously supporting optical access, leading to increased manufacturing complexity and cost due to the need for parallel tight-pitch interconnects and the difficulty in coupling fiber-optic cables effectively.
Innovation Solution
The use of a substrate with a glass core and a dielectric material containing conductive pathways, where the PIC is electrically coupled to the conductive pathways and optically coupled to the glass core through an optical pathway, allowing for both electrical and optical connections with different z-height offsets, and incorporating optical components for stable fiber coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If parallel tight-pitch interconnects are used for high-density electrical communication, then electrical communication density is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent transitions from planar 2D interconnect routing to 3D vertical routing through glass vias and conductive pathways embedded in the glass core. This dimensional change allows interconnects to pass through the substrate vertically rather than routing parallel on the surface, achieving high-density connections while simplifying the overall device architecture and reducing manufacturing complexity.
2Adaptability or versatility
If fiber-optic cables are coupled for optical access, then optical communication capability is improved, but alignment precision and manufacturing difficulty increase
Solution Approach 1:
The patent introduces an optical waveguide embedded in the glass core as an intermediary structure between the fiber-optic cable and the PIC. This waveguide acts as a mediator that guides and aligns optical signals, eliminating the need for precise direct coupling between fibers and PIC components. The waveguide's inherent guiding properties simplify alignment requirements and reduce manufacturing precision demands.
3Adaptability or versatility
If separate electrical and optical connection paths are implemented, then functional versatility is improved, but device complexity increases
Solution Approach 1:
The patent merges electrical and optical connection functions into a single integrated glass core substrate. The glass core simultaneously accommodates conductive pathways for electrical signals and optical waveguides for optical signals, allowing both types of connections to coexist within the same structural element. This consolidation reduces overall device complexity while maintaining full functional versatility for both electrical and optical communications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances interconnect density, reduces signal losses, and lowers manufacturing complexity by enabling efficient electrical and optical communication within a compact footprint, improving the overall performance and cost-effectiveness of PIC packaging.
Implementation Method 1
an optical pathway through the core and the first optical component
Implementation Method 2
a dielectric material including conductive pathways; a photonic integrated circuit (PIC) electrically coupled to the conductive pathways
Data Source
AI summary
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include a substrate having a core with a surface, wherein a material of the core includes glass; and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) electrically coupled to the conductive pathways in the dielectric material; a first optical component between the PIC and the surface of the core, wherein the first optical component is coupled to the surface of the core by optical glue or by fusion bonding; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the core and the first optical component.