Glass Core Substrate for Photonic Integrated Circuit Packaging
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Solution Overview
Problem
Current photonic integrated circuit (PIC) packaging faces challenges in achieving high-density, high-bandwidth electrical communication and simultaneous optical access, with fragile fiber pigtails leading to manufacturing complexities and reduced yields, and existing interconnect technologies suffer from low vertical and horizontal interconnect density.
Innovation Solution
Incorporating a glass core with a dielectric material and conductive pathways into the package substrate, allowing for high-density interconnects and optical coupling through a glass core, enabling both electrical and optical connections to PICs with improved signal integrity and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fiber pigtails are used for optical coupling, then optical access is achieved, but manufacturing complexity increases and yields reduce due to fragility
Solution Approach 1:
The patent extracts the optical coupling function from external fiber pigtails and integrates it directly into the package substrate through glass cores. This eliminates the need for separate fiber pigtail components and their associated fragile connections, thereby reducing manufacturing complexity while maintaining optical coupling reliability.
Solution Approach 2:
The patent merges the optical pathway and electrical interconnect functions into a single integrated package substrate structure. The glass cores are embedded within the substrate to provide optical pathways that align with PICs, while conductive pathways provide electrical connections, eliminating the need for separate fiber pigtail assemblies and reducing overall device complexity.
2Quantity of substance
If existing interconnect technologies are used, then electrical communication is achieved, but interconnect density remains low
Solution Approach 1:
The patent transitions from planar interconnect arrangements to three-dimensional vertical interconnects by embedding glass cores with optical pathways and conductive pathways within the package substrate. This vertical integration enables higher interconnect density by utilizing the third dimension (depth) rather than only horizontal spacing, thereby increasing both interconnect quantity and communication bandwidth.
Solution Approach 2:
The patent uses composite materials combining glass cores with conductive pathways and dielectric materials to create an integrated interconnect structure. The glass provides optical transmission, while embedded conductive pathways provide electrical connections, achieving high-density interconnects that support both optical and electrical communication simultaneously.
3Productivity
If high-density interconnects are implemented, then bandwidth increases, but signal losses may increase
Solution Approach 1:
The patent replaces traditional electrical signal transmission through dense copper interconnects with optical signal transmission through glass core pathways. This substitution eliminates resistive losses associated with high-density electrical interconnects while maintaining high bandwidth, as optical signals do not suffer from the same signal degradation mechanisms in dense configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances interconnect density, reduces signal losses, and improves manufacturing yield by providing a stable optical pathway for PICs, enabling efficient electrical and optical communication while minimizing the fragility issues associated with fiber pigtails.
Implementation Method 1
a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core
Implementation Method 2
an optical pathway through the first optical component and the core
Data Source
AI summary
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a glass core with a surface and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) having an active surface, wherein the PIC is coupled to the surface of the core with the active surface facing away from the core; a processor integrated circuit (XPU) electrically coupled to the conductive pathways in the dielectric material and to the active surface of the PIC; a first optical component optically coupled to a lateral surface of the PIC and to the surface of the core; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core.