Glass-Core PIC Packaging With TGVs for Dense Optical-Electrical Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current photonic integrated circuit (PIC) packaging technologies face challenges in achieving high-density interconnects and minimizing z-height offset between electrical and optical connections, leading to increased manufacturing complexity and cost due to the need for parallel tight-pitch interconnects and exposure of PICs for fiber coupling, which limits the density of electrical and optical connections.
Innovation Solution
The use of a glass interposer with through-glass vias (TGVs) and optical pathways allows for high-density interconnects between PICs and optical components, minimizing z-height offset by optically coupling PICs through the interposer and electrically coupling them via TGVs with hybrid bonds, enabling efficient optical and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If parallel tight-pitch interconnects are used to achieve high-density electrical connections, then electrical interconnect density is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent introduces a glass interposer as an intermediary component between the PIC and the substrate. This interposer contains through-glass vias (TGVs) that provide vertical electrical interconnects, eliminating the need for complex parallel tight-pitch interconnects. The TGVs serve as a mediator that simplifies the interconnection architecture while achieving high-density electrical connections.
Solution Approach 2:
The patent transitions from planar parallel interconnects to vertical three-dimensional interconnects through the glass interposer. The TGVs extend in the vertical dimension (z-direction), allowing electrical connections to pass through the interposer thickness rather than requiring dense lateral routing. This dimensional change enables high interconnect density with simplified manufacturing.
2Ease of operation
If PICs are exposed for fiber coupling, then optical coupling is achieved, but z-height offset between electrical and optical connections increases
Solution Approach 1:
The patent merges the optical coupling function and electrical interconnection function into a single integrated glass interposer structure. The optical pathway through the glass core and the electrical TGVs are combined in the same component, allowing both functions to coexist at the same location without requiring separate exposure regions, thereby minimizing z-height offset.
Solution Approach 2:
The glass interposer acts as a mediator that simultaneously provides both optical transmission and electrical interconnection. The glass material itself serves as the optical pathway while containing the TGVs for electrical connections, eliminating the need to expose the PIC and reducing the z-height offset between electrical and optical connection points.
3Ease of manufacture
If conventional packaging is used, then manufacturing process is simple, but interconnect density and optical signal transmission efficiency are limited
Solution Approach 1:
The patent employs a composite structure combining glass material with metal TGV fills. The glass core provides optical transmission properties while the metal-filled TGVs provide electrical conductivity. This composite approach enables both high interconnect density and efficient optical signal transmission while maintaining manufacturability through established glass processing techniques.
4Productivity
If high-density interconnects are implemented, then bandwidth and communication efficiency are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent achieves high-density interconnects by utilizing the vertical dimension through TGVs that penetrate the glass interposer thickness. This three-dimensional interconnection approach provides high bandwidth and communication efficiency without requiring complex lateral routing, thereby avoiding increased device complexity while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances interconnect density and reduces manufacturing complexity by allowing for compact, high-bandwidth communication between PICs and other components while maintaining stability and efficiency in optical signal transmission.
Implementation Method 1
optical pathway through the interposer
Implementation Method 2
electrically coupling them via TGVs with hybrid bonds
Data Source
AI summary
Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include an interposer having a surface, wherein a material of the interposer includes glass and the interposer includes through-glass vias (TGVs); a photonic integrated circuit (PIC) optically coupled to the surface of the interposer by optical glue or fusion bonding and electrically coupled to the TGVs in the interposer by hybrid bond interconnects; and an optical component optically coupled to the interposer, wherein the optical component is optically coupled to the PIC by an optical pathway through the interposer.