Glass Core Surface Finish Using Electrolytic Plating Seed Layers
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Solution Overview
Problem
Glass core-based semiconductor packaging solutions are not compatible with traditional electroless plating processes due to the shock and sway process, which can damage the glass core, making electrolytic plating necessary but more complex.
Innovation Solution
Implementing a continuous seed layer for electrolytic plating on package substrates with glass cores, allowing for the formation of distinct surface finishes that indicate electrolytic plating was used, and using adhesion promoting layers to enhance the bonding between the surface finishes and solder resist layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional electroless plating process is used, then surface finish can be applied, but glass core may be damaged due to shock and sway process
Solution Approach 1:
The patent extracts the harmful shock and sway process from the plating methodology by transitioning from electroless plating to electrolytic plating. This removes the mechanical vibration step that causes glass core damage while maintaining the ability to apply surface finishes to pads.
Solution Approach 2:
The patent changes the fundamental parameter of the plating method from electroless (chemical deposition) to electrolytic (electrical deposition). This parameter change eliminates the need for shock and sway processes while enabling effective surface finish application on glass core substrates.
2Reliability
If electrolytic plating process is used, then glass core integrity is maintained, but plating process complexity increases
Solution Approach 1:
The patent employs a continuous seed layer that serves multiple functions: it provides electrical conductivity for electrolytic plating, ensures uniform deposit formation, and maintains adhesion to the pad structure. This multi-functional layer simplifies the overall process despite using electrolytic plating.
Solution Approach 2:
The patent performs preliminary actions by pre-forming continuous seed layers and adhesion promoting layers before the electrolytic plating process. These preparatory steps ensure that the subsequent plating operation proceeds smoothly and uniformly, reducing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the successful application of electrolytic surface finishes on glass core-based substrates without damaging the core, simplifying the plating process and ensuring high-quality finishes, while also allowing for the use of glass cores in packaging solutions.
Implementation Method 1
the surface finishes of pads for glass core architectures need to be plated with an electrolytic plating process
Data Source
AI summary
Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core and a pad over the core. In an embodiment, a solder resist is over the pad, and an opening into the solder resist exposes a portion of the pad. In an embodiment, the package substrate further comprises a surface finish over the pad and within the opening.