Glass Core Power Delivery Layout for Stress-Resistant Packaging
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Solution Overview
Problem
Existing glass core substrates for integrated circuit packages face challenges with seware failures, which are characterized by stress concentrations in cavities and webbing, leading to cracking and failure.
Innovation Solution
The implementation of glass cores with embedded power delivery components, featuring large cavities with dielectric fillers and recessed portions with embedded components, reduces stress concentrations by optimizing the thickness and design of power delivery portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass core substrates are used with embedded power delivery components, then power delivery capability and signal transmission are improved, but stress concentrations in cavities and webbing lead to seware failures and cracking
Solution Approach 1:
The patent applies local quality by creating recessed portions in the glass core substrate specifically at locations where power delivery components are embedded. These recessed portions locally modify the substrate structure to reduce stress concentrations in the webbing between cavities, while maintaining the overall glass core architecture for power delivery. This localized structural modification addresses the stress issue without compromising the power delivery capability.
Solution Approach 2:
The patent segments the glass core substrate by creating multiple cavities and recessed portions distributed throughout the structure. This segmentation allows stress to be distributed across multiple localized areas rather than concentrating in single points, reducing the likelihood of seware failures while maintaining effective power delivery through the embedded components.
2Power
If cavities are created for embedded power delivery components, then power delivery is enhanced, but stress concentrations in webbing between cavities cause cracking and failure
Solution Approach 1:
The recessed portions are strategically placed at locations where stress concentrations occur in the webbing between cavities. By locally modifying the substrate thickness and creating recesses, the patent reduces stress concentrations without affecting the overall power delivery capability of the embedded components.
Solution Approach 2:
The recessed portions are created during the substrate formation process before the power delivery components are fully assembled and operated. This preliminary structural modification prevents stress concentrations from developing into cracks during subsequent operation, thereby preventing failure before it occurs.
3Productivity
If through-hole density is increased in glass core substrates, then signal transmission and interconnect density are improved, but structural weakness and failure points increase
Solution Approach 1:
The recessed portions are strategically positioned to provide localized structural reinforcement in areas where through-holes are densely packed. This local modification strengthens the substrate in high-stress regions without reducing the overall through-hole density or interconnect capability.
Solution Approach 2:
The patent creates a composite structure by combining the glass core material with recessed portions that may be filled with different materials or structures. This composite approach allows the substrate to maintain high through-hole density while introducing structural features that prevent failure and enhance overall strength.
Data Source
AI summary
Glass cores with embedded power delivery components are disclosed. An example apparatus includes a glass layer including an opening, a dielectric material within the opening, a first cluster of inductors extending through the dielectric material, and a second cluster of inductors extending through the dielectric material, the second cluster spaced apart from the first cluster, the dielectric material extending continuously from around the first cluster to around the second cluster.