Glass Core Power Regulation With Embedded Varistors and Passives
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Solution Overview
Problem
The integration of power delivery circuits and passive components into semiconductor assembly substrates is challenging, particularly with organic substrates, leading to bulky components that occupy significant space, and existing solutions like discrete varistors are inefficient in voltage stabilization and footprint management.
Innovation Solution
The method involves patterning glass cores to embed components like resistors, capacitors, inductors, and varistors, using thin film varistors in through glass vias to enable voltage stabilization with reduced package size, allowing for power regulation and over-voltage protection within the semiconductor assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If power delivery circuits and passive components are integrated into organic substrates, then device functionality is improved, but the substrate becomes bulky and occupies significant space
Solution Approach 1:
The patent transitions from organic substrates to glass substrates, fundamentally changing the material parameter. Glass substrates enable much smaller component footprints while maintaining integration capability, thus improving device functionality without increasing package size
Solution Approach 2:
The patent utilizes through-glass vias (TGVs) to create vertical three-dimensional interconnections, moving from planar two-dimensional routing to three-dimensional routing. This dimensional change allows power delivery circuits to be integrated vertically within the glass substrate, significantly reducing the horizontal package footprint
2Reliability
If discrete varistors are used for voltage stabilization, then over-voltage protection is provided, but the footprint is large and voltage stabilization efficiency is low
Solution Approach 1:
The patent embeds varistor components directly within the glass substrate structure, nesting them inside the substrate rather than mounting them on the surface. This integration dramatically reduces the footprint while maintaining over-voltage protection functionality
Solution Approach 2:
The patent combines multiple functions into the glass substrate itself: the substrate serves as both the structural base and the housing for power delivery circuits, passive components, and varistors. This merging eliminates the need for separate discrete components, reducing overall footprint and improving voltage stabilization efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the semiconductor assembly footprint by integrating power regulation circuits within the glass core, providing efficient voltage stabilization and over-voltage protection, enabling smaller package sizes and improved performance with fast response times for varistors.
Implementation Method 1
using thin film varistors in through glass vias to enable voltage stabilization with reduced package size
Data Source
AI summary
Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.