Glass Core Antenna Structures for Warpage-Free RF Coupling
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Solution Overview
Problem
Existing electronic packaging solutions face challenges with complex design and fabrication of wired electrical interconnects, particularly in high volume manufacturing, and RF components in buildup layers lead to warpage issues and bandwidth limitations.
Innovation Solution
Embedding RF structures within glass cores with tailored heights and dielectric plugs to form RF systems, allowing for improved data transmission rates and reduced routing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If RF structures are fabricated within buildup layers, then RF coupling capability is achieved, but significant warpage challenges occur
Solution Approach 1:
The patent transitions RF structure fabrication from the buildup layers to the core layer, representing a dimensional shift in the manufacturing space. This relocation to the core layer eliminates the warpage issues that plague buildup layer fabrication while maintaining RF coupling functionality.
Solution Approach 2:
The patent changes the fabrication parameters by moving RF structure formation to the core layer, where different material properties and processing conditions apply. This parameter change enables precise dimensional control without the warpage problems inherent in buildup layer processing.
2Reliability
If wired electrical interconnects are used for component coupling, then electrical connectivity is achieved, but design and fabrication complexity increases
Solution Approach 1:
The patent replaces the mechanical wired electrical interconnect system with an electromagnetic RF coupling system. This substitution eliminates the need for complex copper traces, vias, and pads, thereby reducing design and fabrication complexity while maintaining connectivity functionality.
3Reliability
If wired electrical interconnects are used for routing, then electrical connectivity is achieved, but bandwidth limitations occur
Solution Approach 1:
The patent replaces the wired electrical interconnect system with wireless RF coupling, enabling higher data transmission rates by utilizing electromagnetic field coupling instead of physical conductor routing, thereby overcoming bandwidth limitations.
4Reliability
If precise control of antenna structure dimensions is required, then RF performance is improved, but manufacturing capability is limited
Solution Approach 1:
The patent moves antenna structure fabrication to the core layer, where the manufacturing process provides superior dimensional control capabilities compared to buildup layers. This dimensional shift enables precise control of antenna dimensions while maintaining ease of manufacture through established core layer processing techniques.
Data Source
Figure 1~2A
Figure 2B~2C
Figure 2D~2E
AI summary
An embodiment may include an apparatus comprising: a substrate, wherein the substrate is an amorphous glass layer; an hole into the substrate; and a structure in the hole, wherein the structure comprises: a first portion comprising a first material composition; and a second portion comprising a second material composition, wherein the first portion and the second portion are vertically stacked within the hole.