Glass Core Packaging Substrate With Rounded Edges Against Chipping
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in protecting glass substrates from damage and breakage during the packaging process, particularly due to external impacts and internal stress, which can lead to cracks and chipping, affecting yield and reliability.
Innovation Solution
The packaging substrate features a glass core with curved or chamfered edges and vertices, along with a manufacturing process that includes forming a tapered shape and grinding operations to minimize damage, using methods like dicing sawing, laser cutting, and grinding to create a rounded or chamfered cut surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass substrates are used as packaging substrates, then high-end packaging performance is achieved, but the glass core is vulnerable to external impact and internal stress causing cracks and chipping
Solution Approach 1:
The patent applies curvature to the edges and vertices of the glass core by rounding them with a predetermined radius. This spherical/curved geometry eliminates sharp corners that are prone to stress concentration, thereby preventing cracks and chipping while maintaining the high-end packaging performance of glass substrates.
Solution Approach 2:
The patent performs preliminary protective actions by rounding the edges and vertices of the glass core before the packaging process. This pre-treatment creates a cushioning effect that absorbs and distributes external impacts, preventing stress concentration at sharp corners and reducing the risk of cracks and chipping during subsequent handling and assembly.
2Productivity
If cutting operations are performed on glass cores, then packaging substrates are formed, but the cut surfaces are prone to damage and breakage
Solution Approach 1:
The patent performs preliminary protective actions by rounding the edges and vertices of the cut glass core surfaces. This pre-treatment addresses potential weak points created by cutting operations before the packaging process, ensuring that the cut surfaces are protected against subsequent damage and breakage while maintaining production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the risk of cracks and chipping, enhances durability, and improves the reliability of the packaging substrate by mitigating external shocks during handling and processing, thereby increasing yield and reducing particle defects.
Implementation Method 1
a grinding operation of the cut surface
Implementation Method 2
The cutting operation of the glass core may be performed by dicing sawing or laser cutting
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
An embodiment relates to a packaging substrate and a manufacturing method of the same. The packaging substrate according to an embodiment includes a glass core including a first surface and a second surface facing each other; and an upper layer stacked on the first surface or a lower layer stacked on the second surface, and the corners of the packaging substrate may be treated as curved surfaces or chamfered. Through this, it is possible to protect the glass core from external impact and minimize damage and damage to the glass core.