Glass-Core IC Package Substrate Buffering Against Socket Stress
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Solution Overview
Problem
The existing IC package substrates face issues with stress and damage during assembly due to lateral forces applied during the tightening of fasteners, which can lead to skiving of alignment features and damage to the glass core, resulting in misalignment and failure of the component stack.
Innovation Solution
The IC package substrate design incorporates a glass core with notches and openings at the perimeter, allowing the dielectric material to act as a buffer between the glass core and alignment features, reducing stress and preventing damage by maintaining the glass core's separation from the alignment features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the glass core extends to the perimeter of the substrate, then the structural integrity and rigidity are improved, but the glass core becomes susceptible to stress damage and skiving during assembly
Solution Approach 1:
The glass core is segmented by introducing notches at its perimeter, creating discrete sections rather than a continuous edge. This segmentation allows the dielectric material to intervene between the glass core and alignment features, reducing stress transmission while maintaining overall structural integrity.
Solution Approach 2:
Dielectric material is introduced as an intermediary layer between the glass core and the alignment features. This intermediary buffer absorbs and distributes lateral stresses during fastener tightening, preventing direct stress concentration on the glass core edges and eliminating skiving damage.
2Manufacturing precision
If the glass core is positioned close to alignment features, then the manufacturing precision is improved, but the lateral forces during assembly cause skiving and misalignment
Solution Approach 1:
Dielectric material is pre-positioned between the glass core and alignment features before assembly. This beforehand cushioning creates a stress-absorbing buffer that prevents lateral forces during fastener tightening from causing skiving or misalignment, ensuring both precision and reliability.
3Object-affected harmful factors
If the glass core is protected from lateral forces, then the damage risk is reduced, but the alignment precision may be compromised
Solution Approach 1:
The substrate structure is designed with local quality variations: the glass core maintains its precise positioning for alignment, while the dielectric material is strategically placed only at critical stress zones (between glass core and alignment features). This localized protection preserves alignment precision while providing damage protection where needed.
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and associated integrated circuit packages having glass cores are disclosed. An example integrated circuit package includes: a semiconductor die, and a substrate including a glass core. The substrate includes a first surface, a second surface opposite the first surface, and a third surface between the first surface and the second surfaces. The first surface supports the semiconductor die. The second surface includes first contacts to electrical couple with second contacts in a socket. At least a portion of the third surface separated and distinct from the glass core.