Glass Core Interconnect Assembly for Stable Substrate Geometry
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Solution Overview
Problem
Resin cores and dielectric materials in electronic substrates are prone to deformation under environmental pressures and temperature fluctuations, leading to changes in dimensions and component placement inaccuracies, which affects the stability and efficiency of conductive materials like copper.
Innovation Solution
A glass core layer with prepatterned electrically conductive interconnects and through holes, providing a stable and non-deformable structure that maintains thermal and mechanical stability, minimizing thickness variations and preventing conductive material migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin cores and dielectric materials are used in electronic substrates, then ease of manufacture is improved, but dimensional stability and component placement accuracy deteriorate under environmental pressures and temperature fluctuations
Solution Approach 1:
The patent changes the material parameter from resin/dielectric to glass, which fundamentally alters the thermal and mechanical properties. Glass provides dimensional stability and resistance to deformation under temperature fluctuations and environmental pressures, thereby maintaining component placement accuracy while remaining manufacturable through standard glass processing techniques
Solution Approach 2:
The invention uses a composite structure with glass core layers combined with copper interconnects and dielectric materials. This composite approach leverages the dimensional stability of glass to prevent deformation, while the copper provides electrical conductivity and the dielectric layers provide insulation, creating a balanced system that maintains precision under environmental stress
2Ease of manufacture
If resin cores are used in electronic substrates, then ease of manufacture is improved, but structural stability and shape maintenance deteriorate under applied pressures and temperature changes
Solution Approach 1:
The patent changes the core material parameter from resin to glass, which has superior thermal and mechanical stability. Glass maintains its shape and structural integrity under applied pressures and temperature changes, preventing the deformation issues that plague resin-based substrates while still allowing for standard manufacturing processes
3Device complexity
If conventional substrates with deformable materials are used, then device complexity is reduced, but conductive material migration and thickness variations increase
Solution Approach 1:
The patent changes the material parameter from deformable resin to rigid glass, which eliminates thickness variations and prevents conductive material migration. The glass substrate maintains uniform thickness and stable geometry, ensuring that copper interconnects remain in their intended positions without migrating, while still allowing for relatively simple manufacturing processes
Data Source
AI summary
An electronic system comprising can have a substrate with a core layer formed from at least one layer of glass. The glass layers can each be stacked with a dielectric material disposed between each layer of glass. The glass layers can be prepatterned before assembly of the layered glass core system.