Glass Core Substrate with Through-Thickness Conductors
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Solution Overview
Problem
Current integrated circuit substrates face challenges in providing a stable and efficient electrical connection between the IC die and next-level components due to material limitations, such as warpage and mismatch in thermal expansion coefficients, which affect reliability and interconnect density.
Innovation Solution
A glass core substrate with conductors extending through its thickness, combined with build-up structures and surface treatments, is used to support IC dies and facilitate electrical connections, allowing for improved thermal management and reduced warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional substrate materials are used, then manufacturing is easier and cost is lower, but thermal expansion mismatch and warpage occur reducing reliability
Solution Approach 1:
The patent employs a composite substrate structure consisting of a glass core layer combined with organic overlay layers. The glass core provides dimensional stability and low thermal expansion, while the organic layers provide manufacturing flexibility. This composite approach resolves the contradiction by achieving high reliability through material properties while maintaining ease of manufacture through the benefits of organic materials.
Solution Approach 2:
The patent modifies the thermal expansion parameters of the substrate by selecting glass compositions with specific thermal expansion coefficients that match the IC die. By changing the material parameters (thermal expansion coefficient, glass transition temperature) of the glass core, the substrate achieves compatibility with semiconductor components, eliminating warpage and improving reliability without sacrificing manufacturability.
2Productivity
If interconnect density is increased, then power and signal delivery is improved, but thermal management becomes more difficult
Solution Approach 1:
The glass core substrate has a glass transition temperature above the reflow temperature of the interconnect solder, allowing the substrate to maintain dimensional stability during high-temperature processing. This parameter selection enables high interconnect density to be achieved without compromising thermal management, as the substrate does not deform at elevated temperatures.
Solution Approach 2:
The patent selects glass materials with thermal expansion coefficients matched to the IC die and interconnect materials. This thermal expansion matching prevents warpage during thermal cycling and solder reflow, enabling high interconnect density arrangements without compromising thermal management or structural integrity.
3Reliability
If glass core substrate is used, then thermal expansion mismatch is reduced and reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate uses a composite structure with a glass core layer providing thermal and dimensional stability, combined with organic overlay layers that are easier to manufacture. This composite approach distributes the functional requirements across different material layers, achieving electrical connection stability through the glass core while maintaining manufacturing simplicity through the organic layers.
Solution Approach 2:
The substrate is segmented into distinct functional layers: a glass core layer for thermal stability and dimensional control, and organic overlay layers for electrical and mechanical functionality. This segmentation allows each layer to be optimized for its specific function, achieving reliability without requiring the entire substrate to be complex glass structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass core substrate enhances the reliability of IC packages by reducing thermal expansion mismatch, enabling higher interconnect densities and improved thermal management, thus supporting more efficient power and signal delivery.
Implementation Method 1
reducing thermal expansion mismatch
Data Source
AI summary
A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.