Glass Core Package Substrates With TGV Cavities for Signal Integrity
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Solution Overview
Problem
The challenge in developing package substrates for integrated circuits (ICs) is to provide stable transmission of high-frequency data signals and increased power delivery, especially as ICs shrink in size and interconnect densities rise. Traditional substrate layers are inadequate, and existing methods for fabricating glass cores, such as laser-induced deep etching, are limited by the need for multiple etching processes that can impact the structural integrity of the glass.
Innovation Solution
The implementation of a glass core assembly within the package substrate, which includes through-glass vias (TGVs) and cavities for electronic components, addresses the challenges by using a single laser-induced deep etching process to create multiple openings simultaneously, including TGVs and larger cavities. This approach avoids the negative impacts of multiple etching processes and allows for the integration of electronic components without compromising the glass core's structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple laser-induced deep etching processes are used to create through-glass vias and cavities, then the openings can be created in the glass core, but the structural integrity of the glass core is compromised
Solution Approach 1:
The patent combines multiple laser-induced deep etching operations into a single integrated process. The laser system creates both through-glass vias and component cavities in one continuous operation, eliminating the need for separate etching processes. This merging approach reduces the number of times the glass core is subjected to thermal and mechanical stress, thereby preserving its structural integrity while still achieving the desired multiple openings.
Solution Approach 2:
The patent employs preliminary planning and positioning of all openings (through-glass vias and cavities) before the laser etching process begins. The locations, sizes, and shapes of all openings are predetermined and programmed into the laser system. This preliminary action allows the laser to create all necessary openings in a single coordinated pass, minimizing repeated exposure to the glass core and reducing cumulative damage to its structural integrity.
2Ease of manufacture
If traditional substrate layers are used, then manufacturing is simpler, but stable transmission of high-frequency data signals and increased power delivery cannot be achieved
Solution Approach 1:
The patent changes the fundamental material parameter from traditional substrate layers to a glass core material. This parameter change enables both high-frequency signal transmission stability and increased power delivery capabilities that are not achievable with conventional substrates. The glass core's superior electrical and thermal properties directly address the reliability requirements while the integrated laser fabrication process maintains manufacturing feasibility.
3Productivity
If IC chips reduce in size and interconnect densities increase, then more functionality is achieved, but traditional substrate layers become inadequate
Solution Approach 1:
The patent employs a composite structure combining a glass core with integrated through-glass vias and component cavities. This composite approach allows the substrate to simultaneously support high interconnect densities and maintain the reliability needed for high-frequency operations. The glass core provides a stable foundation that can accommodate increased interconnect density without compromising signal integrity or power delivery capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient and stable transmission of high-frequency data signals and increased power delivery while maintaining the mechanical strength and reliability of the glass core substrate. The integration of electronic components within the glass core assembly enhances design flexibility and reduces signal losses, achieving a higher plated through-hole density and lower total thickness variation.
Implementation Method 1
using a single laser-induced deep etching process to create multiple openings simultaneously, including TGVs and larger cavities
Data Source
AI summary
Package substrates with components included in cavities of glass cores are disclosed. An example apparatus includes: a glass layer having an opening between opposing first and second surfaces of the glass layer; an electronic component within the opening; a dielectric material within the opening between the electronic component and a sidewall of the opening; and a through-glass via including a conductive material that extends through the glass layer.