Glass Core TGV Structure With Protective Resin Against Cracking
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Solution Overview
Problem
The formation of through-glass vias (TGVs) in glass cores is challenging due to the low elasticity of glass, which leads to cracking during processing, and existing methods like laser irradiation result in processing speed and quality trade-offs, along with issues of surface impairment and mechanical weakness.
Innovation Solution
A glass core device with a protective resin covering the surfaces and a method involving laser irradiation, chemical treatment, and resin sealing to form TGVs, ensuring mechanical strength and surface protection by embedding wiring patterns within the TGVs and using a carrier substrate for processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-energy laser beam irradiation is used to form through holes in glass core, then processing speed is improved, but surface flatness deteriorates due to melting and scattering of glass material
Solution Approach 1:
The patent changes the parameter of laser beam energy from high-energy (causing melting) to low-energy (causing minimal damage), while compensating by adjusting other processing parameters to achieve the desired through-hole formation without surface degradation
Solution Approach 2:
The patent converts the harmful effect of laser irradiation (which normally causes melting and surface degradation) into a beneficial process by using controlled low-energy irradiation that forms through holes without creating asperities, thereby eliminating the need for subsequent surface polishing
2Ease of manufacture
If physical processing method using drill or blasting machine is used to form through holes, then processing is simpler, but glass core breaks due to microcracks from low elasticity
Solution Approach 1:
The patent replaces the mechanical processing system (drill or blasting machine) with a non-mechanical laser beam irradiation system, eliminating direct mechanical contact and the associated microcracks that cause glass core breakage
Solution Approach 2:
The patent introduces laser beam irradiation as an intermediary process between the simple drilling concept and the actual through-hole formation, allowing holes to be created without direct mechanical force applied to the glass core
3Ease of manufacture
If wet etching with hydrofluoric acid is used to form through holes, then chemical processing is simpler, but micro-diameter holes cannot be formed due to isotropic reaction
Solution Approach 1:
The patent replaces the chemical etching system with a physical laser beam irradiation system, gaining precise control over hole diameter and shape while maintaining process simplicity through direct writing capabilities
Solution Approach 2:
The patent applies local quality by concentrating laser energy precisely at the desired through-hole locations and dimensions, creating anisotropic removal of glass material only where needed, thereby achieving micro-diameter hole formation with controlled geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a glass core device with higher reliability and mechanical strength by protecting the surfaces and preventing cracking, while improving processing efficiency and quality.
Implementation Method 1
processing methods using irradiation of a high-energy laser beam, such as YAG laser or CO2 laser, achieve relatively high processing speed among the processing methods mentioned above
Implementation Method 2
for example, when through holes are formed in a glass core using a high-energy laser to increase processing speed
Implementation Method 3
The method of forming the through holes may be a physical processing method using a drill or a blasting machine, an etching method using a reactive gas or hydrofluoric acid
Implementation Method 4
an etching method using a fluorine-based reactive gas
Implementation Method 5
when glass cores are wet-etched with hydrofluoric acid, reaction proceeds isotropically
Implementation Method 6
an etching method using a reactive gas or hydrofluoric acid
Data Source
AI summary
A glass core device with a wiring pattern on a first surface of a glass core and a wiring pattern on a second surface thereof being electrically connected via a wiring pattern embedded in TGVs formed in the glass core. In a state of being cut out by dicing, each glass core has a second surface and side faces which are continuously covered with an outer protective layer.