Glass-Core Coplanar Waveguides for High-Density Vertical Die Routing
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Solution Overview
Problem
Legacy package assemblies face challenges in achieving high-speed data communication between dies due to increased substrate layer count and signal integrity issues, particularly with copper clad laminate cores that limit signal density and result in larger package footprints.
Innovation Solution
The use of a glass core with multiple grounded coplanar waveguides on both sides of the substrate allows for high-density vertical transitions and reduced via diameters, enabling increased signal routing density while minimizing signal integrity deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If copper clad laminate cores are used in legacy package assemblies, then manufacturing is easier, but signal density is limited and package footprint increases
Solution Approach 1:
The patent changes the core material parameter from copper clad laminate to glass, enabling smaller via diameters and higher signal density while reducing package footprint. The glass core allows for different electrical and physical properties that support higher density routing.
Solution Approach 2:
The patent utilizes vertical transitions through the glass core to increase signal routing density. By routing signals vertically through the substrate rather than only horizontally on surface layers, the design achieves higher density without increasing footprint area.
2Speed
If substrate layer count is increased to accommodate high-speed signaling, then data communication capability improves, but manufacturing complexity and package size increase
Solution Approach 1:
The patent uses vertical through-substrate vias in the glass core to create high-speed signal paths that penetrate the substrate thickness. This vertical dimension provides additional routing capacity without requiring additional horizontal layers, maintaining manufacturing simplicity while enabling high-speed communication.
3Quantity of substance
If via diameter is reduced to increase signal routing density, then signal density improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the core material to glass, which has properties that enable precise via formation. The glass material allows for controlled via diameter and positioning, achieving high signal routing density while maintaining manufacturability through its favorable processing characteristics.
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, techniques or processes directed to a package that include a substrate with a glass core, with one or more grounded coplanar waveguides placed on one or both surfaces of the glass core. The one or more grounded coplanar waveguides may then be used for high-speed communication between two dies, such as a compute die and a memory die, coupled with the substrate. Other embodiments may be described and/or claimed.