Glass Core Via Seeding for High-Aspect-Ratio 3D Packaging
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Solution Overview
Problem
Current technologies face challenges in integrating multiple semiconductor dies in 3D-IC stacks due to thermal management issues, increased package size, and low yield from substrate manufacturing, particularly when using organic package cores, which affect bandwidth density and power efficiency.
Innovation Solution
The use of a glass core with high aspect ratio vias formed through a physical vapor deposition process, incorporating a laser-assisted etching and dual damascene process to create self-aligned pads and traces, along with a perforated ledge for electrolytic plating, enables high-density via integration with reduced aspect ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If organic package core is used for 3D-IC integration, then die integration is enabled, but thermal management becomes difficult and package size increases
Solution Approach 1:
The patent changes the core material parameter from organic to glass, which fundamentally alters the thermal management properties. Glass cores provide superior thermal conductivity and stability compared to organic materials, enabling effective heat dissipation in 3D-IC stacks while maintaining the die integration capability.
Solution Approach 2:
The patent employs a composite structure combining glass core with metal vias and conductive materials. This composite approach leverages the thermal benefits of glass while incorporating the electrical connectivity of metal structures, achieving both thermal management and electrical functionality in the 3D-IC package.
2Adaptability or versatility
If organic package core is used for 3D-IC integration, then die integration is enabled, but package size increases and yield decreases
Solution Approach 1:
The patent changes the core material parameter from organic to glass, which enables higher via density and smaller via dimensions. This material parameter change allows for more compact via structures that reduce the overall package footprint while maintaining integration capability.
Solution Approach 2:
The patent transitions from planar 2D packaging to vertical 3D stacking architecture. By utilizing the vertical dimension for die stacking and implementing through-glass vias that enable inter-layer connectivity, the design achieves high integration density without increasing the horizontal package area.
3Manufacturing precision
If physical vapor deposition seeding is used for via formation, then high aspect ratio vias can be formed, but process complexity increases
Solution Approach 1:
The patent applies preliminary physical vapor deposition seeding to the glass core surface before via etching. This preliminary action creates a nucleation layer that facilitates subsequent via formation and metal filling, enabling high aspect ratio vias to be formed more reliably despite the increased process steps.
Solution Approach 2:
The PVD seed layer acts as an intermediary between the glass core and the final via structure. This intermediate layer provides a transition interface that enables better adhesion and facilitates the formation of high aspect ratio vias, mediating between the substrate and the via structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for high-density via integration with aspect ratios of 6:1 or greater, reducing thermal challenges and improving electrical performance by enabling smaller package sizes and higher yield in substrate manufacturing.
Implementation Method 1
Physical vapor deposition seeding for high aspect ratio vias in glass core technology
Implementation Method 2
laser-assisted etching
Data Source
AI summary
Embodiments disclosed herein include package substrates and methods of fabricating such substrates. In an embodiment, a package substrate comprises a core with a first surface and a second surface opposite from the first surface. The package substrate further comprises a via hole through the core. In an embodiment the via hole comprises a first portion, a second portion, and a perforated ledge between the first portion and the second portion. In an embodiment, the package substrate further comprises a via filling the via hole.