Glass-Core Component Carrier for Warpage-Stable IC Substrates
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Solution Overview
Problem
Conventional component carriers, particularly those made of IC substrates like FR-4 materials, experience dimensional instability due to moisture absorption and thermal effects, leading to warpage and manufacturing challenges.
Innovation Solution
A component carrier comprising a glass core with applied electrically insulating and conductive layer structures, including inner holes, which provides dimensional stability and reduces crack formation, enabling improved handling and higher signal integrity through the use of resin coated copper foils and magnetic paste for enhanced mechanical and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional IC substrates like FR-4 materials are used, then manufacturing is easier and cost is lower, but dimensional stability deteriorates due to moisture absorption and thermal effects
Solution Approach 1:
The patent uses a glass core as the base material instead of conventional FR-4 substrates. Glass provides superior dimensional stability and lower moisture absorption compared to organic laminate materials, directly resolving the contradiction between manufacturing ease and dimensional stability.
Solution Approach 2:
The patent changes the fundamental material parameter from organic laminate (FR-4) to inorganic glass material. This parameter change fundamentally alters the dimensional stability characteristics, reducing thermal expansion coefficients and moisture absorption, thereby achieving stable dimensions under thermal loads.
2Stability of the object's composition
If glass core is used instead of conventional substrates, then dimensional stability improves, but manufacturing complexity increases
Solution Approach 1:
The patent changes the fundamental material parameter from organic laminate (FR-4) to inorganic glass material. This parameter change fundamentally alters the dimensional stability characteristics, reducing thermal expansion coefficients and moisture absorption, thereby achieving stable dimensions under thermal loads.
3Manufacturing precision
If glass core with insulating and conductive layers is used, then warpage reduces and alignment accuracy improves, but manufacturing process complexity increases
Solution Approach 1:
The patent changes the fundamental material parameter from organic laminate (FR-4) to inorganic glass material. This parameter change fundamentally alters the dimensional stability characteristics, reducing thermal expansion coefficients and moisture absorption, thereby achieving stable dimensions under thermal loads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass core with insulating and conductive layers achieves stable dimensions under thermal loads, reduces warpage, and enhances manufacturing yield, allowing for smaller pitch sizes and higher alignment accuracy, resulting in improved signal integrity and mechanical stability.
Implementation Method 1
The glass core significantly exhibits a dimensional stability under thermal loads and has a lower coefficient of thermal expansion than conventional IC substrates
Implementation Method 2
providing at least one inner hole extending through the glass core and the first electrically insulating layer structure by laser drilling or mechanical drilling or by wet and/or dry etching
Data Source
AI summary
A component carrier includes a glass core having a first main surface and a second main surface; a first electrically insulating layer structure applied on the first main surface of the glass core; a first electrically conductive layer structure applied on the first electrically insulating layer structure; and at least one inner hole extending through the glass core and the first electrically insulating layer structure.