Composite Glass-Core Package Substrates for Warpage Control
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Solution Overview
Problem
Integrated circuit packages face challenges with warpage and shrinkage due to residual stress and CTE mismatch between components, particularly when using glass-based cores, which are difficult to incorporate into existing manufacturing processes.
Innovation Solution
Incorporating a glass layer within a substrate core, surrounded by a glass fiber weave and organic mold, to provide stiffness and resist warpage while being compatible with existing manufacturing methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a glass-based core is used to resist warpage and provide stiffness, then the structural integrity and warpage resistance are improved, but the difficulty of incorporating into existing manufacturing processes increases
Solution Approach 1:
The patent employs a composite core structure combining glass fiber prepreg layers with a solid glass layer. The glass fiber prepreg provides flexibility for manufacturing while the solid glass layer delivers the required stiffness and warpage resistance. This composite approach allows the core to achieve mechanical performance equivalent to or better than traditional glass cores while being compatible with existing manufacturing processes that handle prepreg materials.
Solution Approach 2:
The solid glass layer is positioned specifically within the core structure where maximum stiffness and warpage resistance are needed, rather than making the entire core rigid. This localized application of solid glass allows the rest of the structure to remain flexible and manufacturable using conventional techniques, resolving the contradiction between strength and ease of manufacture.
2Ease of manufacture
If traditional organic material cores are used, then the ease of manufacture is maintained, but the ability to resist warpage and provide structural integrity is reduced
Solution Approach 1:
The core combines organic glass fiber prepreg material (easy to manufacture) with inorganic solid glass layer (high warpage resistance). The glass fiber prepreg layers provide the manufacturability of traditional organic cores while the embedded solid glass layer delivers the enhanced structural integrity and warpage resistance that pure organic materials cannot achieve.
3Strength
If a solid glass layer is added to the core, then the structural integrity and stiffness are enhanced, but the device complexity increases
Solution Approach 1:
The core is segmented into distinct functional layers: glass fiber prepreg layers for manufacturability and bonding, and a solid glass layer for structural strength. This segmentation allows each layer to perform its specific function optimally while the overall assembly remains manageable through standardized layering techniques compatible with existing manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass layer within the substrate core enhances the structural integrity of the substrate, allowing for improved manufacturing processes and maintaining TTV requirements for smaller pitch scaling.
Implementation Method 1
Incorporating a glass layer within a substrate core, surrounded by a glass fiber weave and organic mold, to provide stiffness and resist warpage
Data Source
AI summary
In one embodiment, an apparatus (e.g., a package substrate) includes a core with a layer comprising glass fibers in an epoxy material, a solid glass layer above or on the layer comprising glass fibers in the epoxy material, and a dielectric adjacent the solid glass layer.