Glass Substrate Cutting with Laser-Guided Etch Chamfering
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Solution Overview
Problem
Cutting glass substrates using dry etching methods can damage the cut parts, reducing their mechanical strength, and additional processes are needed to chamfer the edges.
Innovation Solution
A method involving the formation of etch protection layers on both surfaces of the glass substrate, followed by laser pulse penetration to remove parts of these layers and then using an etching solution to cut and chamfer the glass in a single process, adjusting the laser pulse intensity and widths to control the cut shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dry etching (laser cutting) is used to cut the glass substrate, then the glass can be cut, but the cut part is damaged and mechanical strength is lowered
Solution Approach 1:
The patent applies preliminary action by forming an etch protection layer on the glass substrate before cutting. This protective layer is applied in advance to prevent damage to the cut part during the wet etching process, thereby maintaining mechanical strength while enabling efficient cutting.
Solution Approach 2:
The etch protection layer serves as an intermediary between the wet etching solution and the glass substrate. This intermediate layer controls the etching process, preventing direct contact between the aggressive etching solution and the glass surface, thus avoiding damage while achieving clean cuts.
2Manufacturing precision
If additional chamfering process is added to repair cut edges, then edge quality is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges the cutting and chamfering operations into a single wet etching process. By combining these previously separate steps into one integrated process with proper protection, the manufacturing complexity is reduced while maintaining high edge quality through the controlled etching action.
Solution Approach 2:
The wet etching process with etch protection layer performs multiple functions simultaneously: it cuts the glass substrate, protects the cut part from damage, and creates chamfered edges. This multi-functional approach eliminates the need for separate chamfering equipment and processes.
3Manufacturing precision
If etch protection layer is formed on both surfaces, then cutting precision is improved, but manufacturing time increases
Solution Approach 1:
The patent utilizes parameter changes by selecting appropriate materials and thicknesses for the etch protection layer, as well as optimizing the wet etching conditions. These parameter optimizations allow the protection layer to be applied thinly and removed quickly, maintaining precision while minimizing time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents damage to the cut parts and eliminates the need for separate chamfering processes, enhancing the mechanical strength and reducing the number of manufacturing steps.
Implementation Method 1
removing a part of the first protection layer and a part of the second protection layer by applying a laser pulse penetrating the glass substrate from above the first substrate of the glass substrate
Implementation Method 2
forming a cut part in the glass substrate by etching the glass substrate using an etching solution
Data Source
AI summary
A method of manufacturing a glass includes forming a first etch protection layer on a first surface of a glass substrate, and forming a second etch protection layer on a second surface of the glass substrate; removing a part of the first protection layer and a part of the second protection layer by applying a laser pulse penetrating the glass substrate from above the first surface of the glass substrate; forming a cut part in the glass substrate by etching the glass substrate using an etching solution; and removing the first etch protection layer and the second etch protection layer. The second surface is opposite to the first surface.