Glass-Substrate Display Packaging for Thin Reliable Integration
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Solution Overview
Problem
Display devices require smaller bezels and thinner panels while maintaining high reliability and performance, necessitating a reduction in thickness without compromising structural integrity and electrical connectivity.
Innovation Solution
A display device design featuring a glass substrate with integrated semiconductor chips and devices, utilizing a wiring structure that extends across multiple surfaces to provide electrical connections, including redistribution structures and conductive layers, allowing for compact integration of components without overlapping in the vertical direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of display modules is reduced to meet smaller bezel and thinner panel requirements, then the compactness and modern design are improved, but the structural integrity and reliability deteriorate
Solution Approach 1:
The patent implements a multi-layer nested structure where semiconductor chips are mounted on the first surface of the glass substrate, wiring structures extend through the thickness, and additional semiconductor devices are mounted on the second surface. This nesting approach allows compact integration of multiple functional layers within the reduced thickness while maintaining structural coherence and reliability through the glass substrate backbone.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional integration by having wiring structures extend through the thickness of the glass substrate and mounting semiconductor devices on both surfaces. This dimensional transition enables compact integration without increasing the lateral footprint, thereby reducing overall module thickness while maintaining functional density and structural integrity.
2Length of moving object
If components are integrated more compactly to reduce thickness, then the productivity and modern design requirements are met, but the electrical connectivity and signal transmission may deteriorate
Solution Approach 1:
The patent applies different wiring structure configurations to different regions of the glass substrate. Wiring structures extend from the first surface through the thickness to the second surface in regions requiring through-surface connectivity, while other regions utilize surface-mounted connections. This localized optimization ensures reliable electrical connectivity is maintained in critical areas while enabling overall compact integration.
Solution Approach 2:
The glass substrate serves as an intermediary element that provides both mechanical support and electrical connectivity pathways. The wiring structures embedded in or on the glass substrate act as mediators, transmitting electrical signals between semiconductor chips on the first surface and semiconductor devices on the second surface, thereby maintaining reliable electrical connectivity despite the reduced thickness and compact integration.
Data Source
AI summary
A display device includes a glass substrate having a first surface including a chip region and a display region, a second surface opposite to the first surface, and a third surface extending from the first surface and the second surface and being perpendicular to the first surface, a display panel in the display region on the first surface of the glass substrate, a semiconductor chip in the chip region on the first surface of the glass substrate, a wiring structure surrounding the chip region on the first surface of the glass substrate and the second surface and the third surface of the glass substrate, and a plurality of semiconductor devices below the second surface of the glass substrate.