Glass Substrate Edge Reinforcement for Flat Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor devices using glass substrates face challenges in maintaining flatness and protecting the end portions of the glass substrate during processing, leading to potential warpage and cracking, which can misalign optical components and reduce device reliability.
Innovation Solution
A semiconductor device design that includes a glass substrate with a metal film covering the side surfaces and a frame bonded to the metal film, providing enhanced rigidity and protection, along with a metal film that can function as an antenna for wireless communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin material is used to cover the sidewall of glass substrate, then the glass substrate is protected during cutting and processing, but the resin material does not have sufficiently high rigidity to maintain the flatness of the glass substrate
Solution Approach 1:
The patent uses a composite structure consisting of a metal film layer and a resin material layer. The metal film provides high rigidity and structural support to maintain glass substrate flatness, while the resin material provides protective coverage during cutting and processing operations. This composite approach combines the advantages of both materials to resolve the contradiction between protection and rigidity.
2Device complexity
If glass substrate is held only by adhesion between resin material and glass substrate, then the structure is simple, but the glass substrate may warp under external force or the resin material and glass substrate may separate
Solution Approach 1:
The patent employs a composite structure with metal film and resin material working together. The metal film adheres to the glass substrate sidewall providing strong mechanical support and preventing warpage, while the resin material provides additional adhesion and protection. This composite approach enhances the overall bonding strength and structural stability compared to using resin material alone.
3Device complexity
If no rigid protective structure is provided, then the device structure remains simple, but the end portion of the glass substrate may crack, lowering the reliability of the semiconductor device
Solution Approach 1:
The patent uses a composite protective structure comprising metal film and resin material that together provide robust protection against cracking at the glass substrate end portions. The metal film provides structural reinforcement and stress distribution, while the resin material provides protective coverage. This composite approach prevents cracking while maintaining reasonable structural simplicity.
Data Source
AI summary
Provided is a semiconductor device enabling the flatness of a glass substrate to be maintained and enabling the end portion of the glass substrate to be sufficiently protected. A semiconductor device according to the present disclosure includes a glass substrate that includes a first surface, a second surface provided on the opposite side of the first surface, and a first side surface provided between the first surface and the second surface, a wiring that is provided on the first and second surfaces, a metal film that covers the first side surface, and a frame that is provided further on the outer side than the metal film, and that is bonded to the metal film at the first side surface.