Glass Fiber Reinforced Thin Film Package Substrate
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Solution Overview
Problem
Existing package substrates with thin high-density films lack sufficient mechanical strength for easy handling and mounting of chips, as the relationship and structure of fiber-based fillers within redistribution layers are not fully disclosed, making them difficult to handle and reinforce effectively.
Innovation Solution
A glass fiber layer is embedded between the bottom and top redistribution layers to enhance the mechanical strength of the thin film package substrate, with a specific fabrication process involving a release layer, redistribution circuitry, glass fiber lamination, and via openings formed using a laser drill to ensure robustness and electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If fiber-based filler is embedded in dielectric layer or molding compound to reinforce strength, then mechanical strength is improved, but the structural relationship and integration with redistribution layers remains unclear and handling difficulty persists
Solution Approach 1:
The glass fiber layer is nested between the bottom and top redistribution layers, creating a layered structure where each component is integrated into the whole. This nesting approach ensures that the reinforcement layer becomes an intrinsic part of the substrate structure, improving both strength and handling while maintaining clear structural relationships.
Solution Approach 2:
The invention uses a composite structure combining glass fiber layer with dielectric layers and metal redistribution layers. This composite material approach provides mechanical reinforcement through the glass fiber while maintaining electrical functionality through the integrated circuit layers, resolving the contradiction between strength enhancement and operational ease.
2Weight of moving object
If thin film package substrate is used to reduce weight and size, then weight and volume are reduced, but mechanical strength and handling ease deteriorate
Solution Approach 1:
The glass fiber layer is strategically positioned between specific redistribution layers where mechanical strength is most needed for handling and chip mounting. This local reinforcement approach maintains the overall thin film characteristics and weight advantages while providing targeted strength enhancement where required.
Solution Approach 2:
The thin film substrate incorporates a composite structure with glass fiber reinforcement, combining the light weight advantage of thin films with the mechanical strength of fiber-reinforced composites. This allows the substrate to remain lightweight while achieving sufficient mechanical properties for handling and assembly.
3Strength
If glass fiber layer is embedded between redistribution layers, then mechanical strength and handling ease are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The glass fiber layer is prepared and positioned between redistribution layers during the fabrication process before final assembly. This preliminary action ensures proper integration and alignment, reducing subsequent manufacturing complexity and ensuring consistent mechanical reinforcement throughout production.
Solution Approach 2:
The glass fiber layer is nested within the sequence of dielectric and metal layers during fabrication, creating an integrated layered structure. This nesting approach allows all layers to be processed and assembled in a systematic manner, reducing overall device complexity despite the additional reinforcement layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass fiber reinforcement significantly improves the mechanical strength and handling of the thin film package substrate, enabling easier chip mounting and enhancing the substrate's overall structural integrity.
Implementation Method 1
A glass fiber layer is embedded in a thin film package substrate to reinforce the strength of the thin film package substrate
Implementation Method 2
via openings formed using a laser drill to ensure robustness and electrical coupling
Implementation Method 3
forming a first redistribution circuitry 110 on a top side of the release layer 101... A plurality of first bottom metal pads 111 is configured on a bottom side of the first redistribution circuitry 110
Data Source
AI summary
A glass fiber layer is embedded in a thin film package substrate to reinforce the strength of the thin film package substrate. The thin film package substrate has a bottom redistribution circuitry and a top redistribution circuitry. The glass fiber layer is configured between the bottom redistribution layer and the top redistribution layer. A topmost metal pads of the bottom redistribution layer and a bottommost metal vias of the top redistribution layer are embedded in the glass fiber layer.