Laser-Welded Glass Substrate Frame for IC Package Brittleness

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Solution Overview

Problem

Glass substrates used in IC packages are brittle and prone to damage due to their fragility, which poses challenges in manufacturing and assembly, particularly due to coefficient of thermal expansion (CTE) mismatches and stress-related issues.

Innovation Solution

A metallic frame structure is coupled with the glass substrate using laser processing to provide mechanical support, with laser parameters adjusted to weld the glass to the frame and form a curved edge for enhanced adhesion, and sealant structures are used to secure the interface, with the frame structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If glass substrate is used for IC package, then electrical properties and CTE match with silicon IC dies, but brittleness causes manufacturing and assembly challenges

Engineering Contradiction:
Improveelectrical properties and CTE matchVSAvoidbrittleness
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent combines glass substrate with a metallic frame structure to create a composite assembly. The glass provides electrical properties and CTE matching, while the metal frame provides mechanical strength and stress relief, resolving the contradiction between reliability and strength.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The glass substrate is segmented by introducing a metallic frame structure that divides the glass into supported regions. This segmentation allows the glass to maintain its electrical properties while the metal frame bears the mechanical loads, reducing the impact of glass brittleness.

Inventive Principle:
Principle #1Segmentation

2Reliability

If glass substrate is used, then good electrical properties are achieved, but stress-related issues and CTE mismatches occur

Engineering Contradiction:
Improveelectrical propertiesVSAvoidstress-related issues and CTE mismatches
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent changes the structural parameters by adding a metallic frame with specific geometric features (curved edges, recesses) that accommodate thermal expansion differences. This allows the assembly to maintain electrical properties while compensating for CTE mismatches through the frame's mechanical compliance.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The metallic frame acts as an intermediary between the glass substrate and the external environment. It mediates the stress and thermal expansion issues, protecting the glass from direct mechanical and thermal stresses that would cause composition instability.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If laser processing is used to weld glass to frame, then mechanical support is provided, but process complexity increases

Engineering Contradiction:
Improvemechanical supportVSAvoidlaser processing parameters
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent optimizes laser processing parameters (power, speed, focus) to achieve effective welding of glass to metal frame. By carefully controlling these parameters, strong mechanical support is achieved while keeping the process manageable through systematic parameter optimization.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively addresses the fragility of glass substrates by providing mechanical support to the glass substrates, enhancing their durability and reducing the risk of damage due to the fragility of glass substrates by providing mechanical support.

Implementation Method 1

A metallic frame structure is coupled with the glass substrate using laser processing to provide mechanical support, with laser parameters adjusted to weld the glass to the frame

Methodology Applied
Scientific EffectLaser welding: Laser Beam Welding

Data Source

PatentUS20260005109A1Device, method and system for supporting a glass substrate with a frame structure
Publication Date: 2026.01.01 INTEL CORP
  • US20260005109A1 patent drawing
  • US20260005109A1 patent drawing
  • US20260005109A1 patent drawing

AI summary

Techniques and mechanisms for a frame structure to be coupled to mechanically support a glass substrate. In some embodiments, a substrate comprises a glass material which forms an exterior edge, wherein one or more conductive vias variously extend through the glass material. The exterior edge is proximate to an interior edge of a frame structure which comprises one or more metal layers. Coupling of the substrate with the frame structure includes or is otherwise facilitated by a beam of laser light being directed at least to the exterior edge. In another embodiment, the beam of laser light welds the glass material to a metal of the frame, or forms a curved surface of the exterior edge, which increases surface area to improve adhesion of the glass material with other structures.