Radio Frequency Module With Glass-Free Dielectrics for Shielding Reliability
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Solution Overview
Problem
Existing radio frequency modules face challenges in improving the reliability of shielding properties, particularly due to differences in thermal expansion coefficients between dielectric layers containing glass fibers, which can lead to warpage and disconnection at connection points.
Innovation Solution
A radio frequency module design featuring a mounting substrate with dielectric layers made of resin without glass fibers, interconnected by ground electrodes directly connected to an external shield layer, reducing thermal expansion mismatches and enhancing structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If dielectric layers contain glass fibers to improve mechanical strength, then structural integrity is enhanced, but thermal expansion coefficient differences cause warpage and disconnection at connection points
Solution Approach 1:
The patent changes the material composition parameter of the dielectric layers by removing glass fibers and using resin-only compositions. This parameter change reduces the thermal expansion coefficient differences between dielectric layers and the ground electrode, preventing warpage and maintaining reliable electrical connections for shielding while still providing adequate mechanical strength through the resin matrix and supporting structural elements.
2Reliability
If ground electrode connection to external shield layer is made to improve shielding reliability, then electromagnetic shielding effectiveness is enhanced, but thermal expansion mismatches cause disconnection at connection points
Solution Approach 1:
The patent changes the thermal expansion parameter of the dielectric layers by using resin-only materials with lower thermal expansion coefficients. This parameter change reduces thermal stress at the ground electrode connection points to the external shield layer, maintaining stable electrical connections and reliable shielding effectiveness under temperature variations.
Solution Approach 2:
The patent introduces resin dielectric layers as intermediary materials between the ground electrode and external shield layer. These resin layers act as flexible intermediaries that accommodate thermal expansion differences while maintaining electrical connectivity, preventing direct stress transmission that would cause disconnection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves shielding reliability by minimizing warpage and disconnection risks, ensuring consistent performance under temperature changes and enhancing electromagnetic shielding effectiveness.
Implementation Method 1
differences in thermal expansion coefficients between dielectric layers containing glass fibers, which can lead to warpage and disconnection at connection points
Implementation Method 2
The external shield layer covers at least part of an outer peripheral surface of the mounting substrate and covers the resin layer
Data Source
AI summary
In a radio frequency module, a resin layer is disposed on a first main surface of a mounting substrate and covers electronic components. An external shield layer covers at least part of an outer peripheral surface of the mounting substrate and the resin layer. The mounting substrate includes a first dielectric layer, a second dielectric layer, and ground electrodes. The first dielectric layer contains a resin and does not contain a glass fiber. The second dielectric layer overlaps the first dielectric layer in a thickness direction of the mounting substrate and is in contact with the first dielectric layer. The second dielectric layer contains a resin and does not contain a glass fiber. The ground electrodes are interposed between the first dielectric layer and the second dielectric layer. The ground electrodes are each directly connected to the external shield layer.