Laminated Glass Panels with High Interlayer Thickness Factors
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Solution Overview
Problem
Conventional laminated glass panels struggle to effectively improve sound transmission loss, especially at the coincident frequency region, due to limitations in increasing surface density without adverse effects on noise transmission between 3000 and 5000 Hz.
Innovation Solution
Increasing the interlayer thickness factor of multiple layer glass panels to at least 0.80, using a configuration with stiff and soft poly(vinyl butyral) layers, and positioning the soft layer non-centrally within the interlayer to enhance sound insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the combined glass thickness is increased to improve sound transmission loss, then sound insulation improves, but weight increases and the coincident frequency dip is not effectively addressed
Solution Approach 1:
The patent changes the parameter of interlayer thickness from conventional values to at least 0.80, which fundamentally alters the acoustic performance characteristics of the laminate. This parameter change effectively addresses the coincident frequency dip and improves sound transmission loss without requiring increased glass thickness, thereby avoiding additional weight.
Solution Approach 2:
The patent employs a composite interlayer structure combining stiff and soft poly(vinyl butyral) layers. This composite material approach creates synergistic acoustic performance where the stiff layers provide structural integrity and the soft layer provides acoustic damping, achieving superior sound insulation without increasing glass thickness or weight.
2Object-affected harmful factors
If the interlayer thickness is increased to improve sound insulation, then sound transmission loss improves, but the overall panel thickness increases
Solution Approach 1:
By optimizing the interlayer thickness parameter to at least 0.80 and configuring the stiff/soft layer structure, the patent achieves enhanced sound transmission loss with minimal impact on overall panel thickness. The specific layer configuration maximizes acoustic performance per unit thickness.
Solution Approach 2:
The patent applies local quality by positioning the soft poly(vinyl butyral) layer specifically between the stiff layers, creating zones of different acoustic properties within the interlayer. This localized soft layer provides acoustic damping where most needed while maintaining overall panel compactness.
3Weight of moving object
If asymmetric glass configuration is used to reduce weight, then weight decreases, but sound insulation properties deteriorate
Solution Approach 1:
The patent uses a composite interlayer with stiff and soft poly(vinyl butyral) layers that compensates for the reduced glass mass in asymmetric configurations. The composite interlayer provides the acoustic damping and mass needed to maintain sound insulation performance even when glass thickness is reduced for weight savings.
Solution Approach 2:
The patent changes the interlayer thickness parameter to at least 0.80, which compensates for the reduced acoustic mass from asymmetric glass configurations. This parameter change ensures that sound transmission loss is maintained or improved despite using lighter, asymmetric glass arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves sound transmission loss at the coincident frequency and in the frequency range of 3000 to 5000 Hz, providing better sound insulation compared to traditional methods of increasing combined glass thickness.
Implementation Method 1
a multiple layer acoustic interlayer comprising a first stiff poly(vinyl butyral) layer, a second stiff poly(vinyl butyral) layer, and a soft poly(vinyl butyral) layer between the first and second stiff layers
Implementation Method 2
the multiple layer panel has an interlayer thickness factor greater than about 0.80... significantly improves sound transmission loss at the coincident frequency
Data Source
Figure 1a~2b
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AI summary
A multiple layer panel having improved sound insulation is disclosed. The multiple layer panel comprises a first rigid substrate having a first thickness H3, a second rigid substrate having a second thickness H1, wherein H3 ≤ H1, and a multiple layer acoustic interlayer having a thickness H2 between the first and second rigid substrates.