Glass Interposer Camera Module with Lateral Conductive Traces
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Solution Overview
Problem
Camera modules in portable devices face alignment issues due to the stacking of components, which contributes to errors in lens and image sensor alignment, and organic substrates are prone to warping, leading to misalignment and reliability problems.
Innovation Solution
A chip scale package camera module with a glass interposer that includes multiple layers of optical glass and conductive paths to connect the image sensor with other components, featuring an infrared filter coating to prevent infrared light interference and reduce module thickness, while providing stable electrical connections without blocking light paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple components are stacked one on top of another to reduce lateral space, then the camera module becomes more compact, but alignment errors between lens and image sensor increase
Solution Approach 1:
A glass interposer is introduced as an intermediary component between the lens and image sensor. The glass interposer includes conductive traces and vias that provide stable electrical connections while maintaining precise alignment. The glass material itself provides dimensional stability and does not warp like organic substrates, thereby preserving alignment accuracy in the stacked configuration.
Solution Approach 2:
The patent uses a composite structure combining glass interposer with organic substrate. The glass interposer provides dimensional stability and alignment precision, while the organic substrate provides electrical connectivity. This composite approach allows compact stacking while maintaining manufacturing precision through the glass component's stability.
2Ease of operation
If organic substrate is used to connect image sensor with other components, then electrical connections are established, but warping occurs causing misalignment
Solution Approach 1:
The glass interposer serves as a stable intermediary that does not warp. It provides a rigid foundation for mounting the image sensor and maintaining alignment, while electrical connections are established through conductive traces and vias formed in the glass interposer and connecting to components on both sides.
Solution Approach 2:
The patent applies different materials with different properties to different locations: glass interposer where dimensional stability is critical (between lens and sensor), and organic substrate where electrical connectivity is primary. The glass interposer specifically addresses the stability requirement in the optical path area.
3Ease of operation
If conductive paths are added to connect components through glass interposer, then electrical connectivity is improved, but light path may be blocked
Solution Approach 1:
Conductive traces are routed in lateral dimensions on the glass interposer rather than vertically through the light path. Vias are positioned at the periphery or in areas that do not intersect with the optical axis. This dimensional arrangement allows electrical connections without blocking light transmission through the glass interposer.
Solution Approach 2:
The glass interposer has different properties in different regions: areas through which light passes are kept free of conductive elements, while peripheral or lateral areas contain the conductive traces and vias for electrical connectivity. This local differentiation ensures both light transmission and electrical connection functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The glass interposer enhances alignment accuracy and reliability by reducing thickness, improving thermal stability, and minimizing warping, resulting in a more precise and durable camera module with improved long-term performance.
Implementation Method 1
The glass interposer also includes an infrared filter coating that acts to prevent or reduce the amount of infrared light that would otherwise reach the image sensor
Data Source
AI summary
One or more embodiments disclosed herein are directed to a chip scale package camera module that includes a glass interposer between a lens and an image sensor. In some embodiments, the glass interposer is made from one or more layers of optical quality glass and includes an infrared filter coating. The glass interposer also includes electrically conductive paths to connect the image sensor, mounted on one side of the glass interposer, with other components such as capacitors, which may be mounted on a different side of the glass interposer, and the rest of the camera system. The conductive layers include traces and vias that are formed in the glass interposer in areas away from the path of light in the camera module, such that the traces and vias do not block the light between the lens and the image sensor.