Glass Interposer Package with Embedded Bridge for Scalable Chip Modules
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Solution Overview
Problem
Conventional wafer-based chip packaging technologies face limitations in scalability for larger chip modules due to reticle size constraints, which restricts the integration of multiple integrated circuit dies and interconnect density.
Innovation Solution
A chip package design utilizing a glass interposer with an embedded interconnect bridge that couples two chip modules to a package substrate, enabling high-density interconnects and scalability through redistribution layers on the glass interposer, allowing for the integration of multiple IC dies and photonic connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If wafer-based packaging is used to achieve high interconnect density, then manufacturing precision is improved, but scalability is limited due to reticle size constraints
Solution Approach 1:
The packaging system is divided into multiple segments: a glass interposer substrate, multiple chip modules (each containing one or more IC dies), and an interconnect bridge. This segmentation allows the system to exceed reticle size limits by assembling multiple smaller components into a larger integrated structure, thereby achieving both high interconnect density and scalability.
Solution Approach 2:
The patent employs a nested structure where IC dies are mounted on a glass interposer to form chip modules, which are then integrated with an interconnect bridge on the same interposer. This nested arrangement enables high-density integration within a scalable footprint, allowing the system to maintain precision while adapting to larger module sizes.
2Adaptability or versatility
If multiple IC dies are integrated to increase functionality, then device complexity is improved, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The glass interposer serves as an intermediary substrate that facilitates the integration of multiple IC dies and the interconnect bridge. It provides a stable platform with embedded routing structures that simplify the alignment and connection processes, thereby maintaining manufacturing precision even as the number of integrated components increases.
Solution Approach 2:
The glass interposer performs multiple functions: it serves as a mechanical support substrate, provides electrical routing pathways, hosts both chip modules and interconnect bridges, and enables thermal management. This multi-functionality reduces the need for additional specialized components, simplifying the overall manufacturing process while maintaining precision.
Data Source
AI summary
A chip package having a package substrate including a top surface. A first chip module and a second chip module are mounted above the top surface of the package substrate. A first interposer is disposed between the package substrate and the first and second chip modules and includes a glass interposer. The first interposer couples the first and second chip modules to the package substrate. An interconnect bridge is disposed in a cavity of the glass interposer. The interconnect bridge includes circuitry that connects a circuitry of the first chip module to a circuitry of the second chip module.