Glass Interposer Division via Laser Groove Ablation

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Solution Overview

Problem

The exfoliation of stacked bodies from glass substrates during the division process in manufacturing glass interposers, caused by stress from resin shrinkage and chipping at cut sections, leads to inefficiencies and increased processing time, as existing methods like using finer cutting blades do not perfectly inhibit exfoliation and can result in blade entanglement.

Innovation Solution

A method involving the formation of first grooves with a cutting blade, followed by laser ablation to expose the glass substrate, and the creation of modified layers within the glass substrate using a laser beam, allowing for division without stress on residual resin portions, thus preventing exfoliation and reducing processing time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a high-numbered cutting blade with finer abrasive grains is used to reduce chipping ruggedness, then exfoliation of the stacked body is restrained, but processing time increases and exfoliation cannot be perfectly inhibited

Engineering Contradiction:
Improveexfoliation preventionVSAvoidprocessing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent applies preliminary action by forming grooves at the cut sections before the division process. These grooves are filled with resin that is cured to form a reinforcing structure. This preliminary reinforcement prevents chipping and exfoliation during subsequent handling and division, eliminating the need for excessive grinding that would increase processing time.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the physical-chemical parameters of the cut section by filling grooves with resin and curing it. This transforms the weak, chprone cut surface into a reinforced structure with improved mechanical properties. The resin filling modifies the surface morphology and strength parameters, preventing exfoliation without requiring time-consuming fine grinding.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If the stacked bodies and glass substrate are cut simultaneously, then processing efficiency is maintained, but the cutting blade gets caught on the stacked body causing exfoliation

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidexfoliation prevention
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies segmentation by separating the cutting process into two distinct stages: first cutting the glass substrate, then separately cutting the stacked bodies. This segmentation prevents the cutting blade from encountering both materials simultaneously, eliminating the risk of blade entanglement on the stacked body that would cause exfoliation. Each material is cut with optimized parameters suitable for its specific properties.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If the resin is cured by cooling which causes shrinkage, then the insulating layer is formed, but stress from shrinking force remains in the insulating layer leading to exfoliation

Engineering Contradiction:
Improveinsulating layer formationVSAvoidexfoliation prevention
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies beforehand cushioning by filling grooves at the cut sections with resin and curing it. This creates a compensating structure that counteracts the stress from resin shrinkage during curing. The filled grooves provide mechanical support and stress distribution, preventing the shrinkage-induced stress from causing exfoliation at the vulnerable cut sections.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively prevents exfoliation of stacked bodies from the glass substrate during division, allowing for efficient production of glass interposers with reduced processing time and avoiding blade entanglement issues.

Implementation Method 1

a second groove forming step of applying a laser beam of such a wavelength as to be absorbed in the resin layer to the bottoms of the first grooves formed in the first groove forming step to perform ablation processing of the residual resin portion

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

a modified layer forming step of applying a laser beam of such a wavelength as to be transmitted through the glass substrate through the second groove on the front surface or the back surface of the glass substrate along the division lines, with a focal point set in inside of the glass substrate, to form modified layers in the inside of the glass substrate

Methodology Applied
Scientific EffectLaser heating: Laser

Data Source

PatentUS10796926B2Method of manufacturing glass interposer
Publication Date: 2020.10.06 DISCO CORP
  • US10796926B2 patent drawing
  • US10796926B2 patent drawing
  • US10796926B2 patent drawing

AI summary

In a method of manufacturing a glass interposer, first, stacked bodies formed on a front surface and a back surface of a glass substrate are processed along division lines (streets) to form first grooves having a first width and such a depth as not to reach the glass substrate, while leaving a residual resin portion at bottoms of the first grooves. Thereafter, the residual resin portion is subjected to ablation processing to expose the front surface and the back surface of the glass substrate, thereby forming second grooves having a second width narrower than the first width. A laser beam is applied along the division lines through the second grooves to form modified layers in the inside of the glass substrate, and an external force is exerted on the glass substrate to divide the glass substrate, with the modified layers as division starting points.