Glass Interposer Microfluidic Channels for IC and Fluid Integration
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Solution Overview
Problem
Current technologies face challenges in integrating semiconductor devices with microfluidics in large-scale manufacturing, particularly in creating sophisticated 'lab-on-a-chip' systems that require miniaturization and high performance, due to manufacturing complexities in combining electronic and fluid dynamics.
Innovation Solution
A microelectronic assembly is developed, featuring an interposer with a glass substrate containing microfluidic channels and IC dies embedded in organic dielectric material, where through-glass vias and conductive traces facilitate electrical connections and fluid flow, enabling efficient integration of semiconductor and microfluidic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor devices and microfluidics are integrated in large-scale manufacturing, then functionality and performance are improved, but manufacturing complexity increases
Solution Approach 1:
The device is divided into distinct functional modules: semiconductor components for electronic processing, microfluidic channels for fluid transport, and interposer structures for integration. This segmentation allows each module to be manufactured separately using optimized processes before being assembled into the complete integrated system, thereby managing manufacturing complexity while achieving sophisticated functionality.
Solution Approach 2:
An interposer structure serves as an intermediary component that facilitates the integration of semiconductor devices with microfluidic systems. The interposer provides mechanical support, electrical interconnections, and fluidic interfaces, enabling the coupling of otherwise incompatible manufacturing processes and material systems while maintaining large-scale manufacturability.
2Volume of moving object
If miniaturization is implemented in lab-on-a-chip systems, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The design transitions from planar two-dimensional layouts to three-dimensional vertical integration, stacking semiconductor components, microfluidic channels, and interposer structures in multiple layers. This dimensional change allows compact miniaturization while distributing manufacturing precision requirements across multiple fabrication steps and material systems, each optimized for their specific dimensional constraints.
Data Source
AI summary
Embodiments of a microelectronic assembly includes: an interposer comprising a first portion in contact along an interface with a second portion; a first integrated circuit (IC) die embedded in a dielectric material in the first portion of the interposer; and a second IC die coupled to the first portion of the interposer opposite to the second portion, wherein: the second portion comprises a glass substrate with a channel within the glass substrate, a portion of the channel has an opening at the interface, a conductive pad in the first portion is exposed in the opening, and the conductive pad is coupled to a circuit in at least one of the first IC die or the second IC die.