Glass Interposer Optical Modulator Integration for High-Bandwidth Links
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Solution Overview
Problem
Existing semiconductor and photonic devices face challenges in achieving faster communication speeds and higher bandwidth while maintaining smaller form factors and lower manufacturing costs, particularly in optical fiber communication systems.
Innovation Solution
Integration of photonic integrated circuits and optical components with a glass interposer, utilizing electro-optical materials like GaAs, PbMoO4, TeO2, and LiNbO3, to form devices such as electro-optic modulators, optical resonators, and electro-optic switches, which are fabricated integrally with the glass substrate, allowing for reduced device size and cost through existing semiconductor processing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical fiber communication technology is used to achieve faster communication speeds and higher bandwidth, then communication performance is improved, but device size and manufacturing cost increase
Solution Approach 1:
The patent combines multiple optical components (modulators, resonators, switches) and photonic integrated circuits into a single glass interposer substrate. This integration merges previously separate components into one unified device, achieving faster communication speeds while reducing the overall device size and form factor.
Solution Approach 2:
The glass interposer serves multiple functions simultaneously: it acts as a substrate for photonic integrated circuits, provides mechanical support, enables optical signal transmission, and houses multiple optical components. This multi-functionality allows the device to achieve high bandwidth communication while maintaining a compact size.
2Speed
If optical fiber communication technology is used to achieve faster communication speeds and higher bandwidth, then communication performance is improved, but manufacturing cost increases
Solution Approach 1:
By integrating multiple optical components and photonic circuits onto a single glass interposer, the patent reduces the number of separate manufacturing steps and assembly operations required. This consolidation lowers manufacturing complexity and cost while maintaining high communication speeds.
Solution Approach 2:
The patent utilizes existing semiconductor processing techniques and adapts them for glass substrate fabrication. By changing the manufacturing approach to leverage established processes, the cost of producing high-performance optical devices is reduced.
3Volume of moving object
If smaller form factor optical devices are created, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The integration of multiple optical components onto a single glass interposer creates a compact device while simplifying the overall manufacturing process. Instead of manufacturing and assembling multiple separate components, the integrated approach reduces manufacturing complexity despite the smaller form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration results in smaller, more efficient optical devices with improved signal quality and refined frequency control, enabling higher bandwidth communication at lower manufacturing costs.
Implementation Method 1
electro-optical materials like GaAs, PbMoO4, TeO2, and LiNbO3, to form devices such as electro-optic modulators
Implementation Method 2
optical resonators, and electro-optic switches, which are fabricated integrally with the glass substrate, allowing for reduced device size and cost through existing semiconductor processing techniques
Data Source
AI summary
Electro-optical systems having one or more electro-optical devices integrally formed within a substrate and associated methods are disclosed. An example electro-optical system includes a substrate; an electronic integrated circuit (EIC) over a first portion of the substrate; and an optical modulator over a second portion of the substrate, wherein the optical modulator includes a first waveguide splitting into a second waveguide and a third waveguide, and a fourth waveguide, wherein, after splitting from the first waveguide, the second waveguide and the third waveguide are recombined into the fourth waveguide.