Glass Interposer Switching Module for High Port Count Data Centers
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Solution Overview
Problem
Conventional data center switches face challenges in achieving high port counts and low power dissipation, with existing solutions like packet switches consuming excessive power and having limitations in bandwidth and port counts, while all-optical switching offers low latency but is limited by slow switching, quasi-static connections, and limited port counts.
Innovation Solution
A high port count switching module utilizing a glass interposer with cross-point switches and optical transceivers, providing low-loss RF connections and thermal isolation, enabling dense packaging and low power consumption, with the glass interposer offering superior mechanical stability, low dielectric loss, and efficient cooling through copper Through Glass Vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional packet switches with ASICs are used to increase switching capacity, then bandwidth capacity is improved, but power consumption increases significantly
Solution Approach 1:
The patent replaces conventional electrical packet switching ASICs with an all-optical switching system using VCSELs, waveguides, and photodetectors. This substitution eliminates the need for electrical signal processing in the switching fabric, dramatically reducing power consumption while maintaining high switching capacity. The optical switching fabric uses passive waveguide-based routing instead of active electrical components.
Solution Approach 2:
The patent changes the fundamental operating parameters of the switching system by transitioning from electrical signals to optical signals. This parameter change enables higher bandwidth capacity through optical carriers while simultaneously reducing power consumption by eliminating resistive losses and active electrical switching operations. The system operates at optical frequencies rather than electrical frequencies.
2Device complexity
If VCSELs and photodetectors are directly attached to CMOS switching ASICs to reduce coupling, then integration is improved, but the number of implementable fiber connections is limited
Solution Approach 1:
The patent transitions from planar 2D integration of VCSELs and photodetectors on ASIC surfaces to three-dimensional integration using vertical waveguide structures and stacked optical components. This dimensional change enables multiple fiber connections by routing optical signals through vertical waveguides that can be densely packed in the third dimension, dramatically increasing the number of implementable fiber connections while maintaining compact integration.
Solution Approach 2:
The patent implements a nested structure where multiple optical channels are integrated within a compact footprint by nesting waveguide structures and optical components. The waveguide-based optical network fabric allows multiple optical paths to be nested within the same physical substrate, enabling a high number of fiber connections without proportionally increasing device complexity or footprint.
3Speed
If all-optical switching is used to reduce latency and transceiver requirements, then switching speed is improved, but port count is limited
Solution Approach 1:
The patent segments the optical switching fabric into multiple independent switching stages using cascaded stages of VCSELs, waveguides, and photodetectors. Each stage handles a portion of the total traffic, and the segmented architecture allows the system to scale to high port counts by adding more switching stages rather than limiting the port count. This segmentation maintains fast switching speed while enabling scalability to hundreds of ports.
4Power
If optical transceivers are used for high bandwidth, then data transmission capacity is improved, but power consumption and internal interconnection overhead increase
Solution Approach 1:
The patent creates a universal optical interface where the same waveguide-based optical switching fabric handles both internal interconnections and external fiber connections. This multi-functional approach eliminates the need for separate electrical packet switching infrastructure, reducing overall power consumption while maintaining high data transmission capacity. The optical fabric universally handles all switching operations without requiring additional electrical transceivers for internal routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a high port count switching capacity of over 25 Tbps with reduced power consumption and dense packaging, supporting flexible and scalable optical signal connectivity, and simplifying future data rate and port count increases due to intrinsic low power consumption and high RF performance.
Implementation Method 1
thermal isolation among the plurality of switching circuits due to low thermal conductivity of glass, relative to a silicon, organic, or ceramic interposer
Implementation Method 2
a low dielectric loss, relative to a silicon, organic, or ceramic interposer, to allow wideband data transmission
Implementation Method 3
high local thermal conductivity by copper Through Glass Vias (TGVs) to allow cooling of the plurality of switching circuits
Implementation Method 4
a smooth surface, resulting in smooth metal traces to minimize high-frequency skin effect loss
Data Source
AI summary
A high port count switching module includes a plurality of switching circuits disposed on a glass interposer, wherein the plurality of switching circuits each include cross-point switches configured to perform switching at a full signal rate; and a plurality of optical transceivers disposed on the glass interposer and communicatively coupled to the plurality of switching circuits. The glass interposer has i) a low dielectric loss, relative to a silicon, organic, or ceramic interposer, to allow wideband data transmission, ii) a smooth surface, resulting in smooth metal traces to minimize high-frequency skin effect loss, iii) a coefficient of thermal expansion that is matched to the plurality of switching circuits to minimize stresses, and iv) thermal isolation among the plurality of switching circuits due to low thermal conductivity of glass.