Glass Interposer TGV RF Components
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Solution Overview
Problem
Silicon interposers in packaged integrated circuits suffer from high electrical conductivity and substrate loss, leading to interference from neighboring signal traces and increased costs, which limits their effectiveness in RF/microwave applications.
Innovation Solution
The use of glass interposers with through-glass vias (TGVs) fabricated using the Corning fusion process, combined with substrate integrated waveguide (SIW) technology and metamaterial resonators like complementary split-ring resonators (CSRRs), offers low substrate loss, mechanical robustness, and reduced manufacturing costs, enabling high-quality RF components and systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon interposers are used in packaged integrated circuits, then routing paths and interconnection are provided, but substrate loss and interference from neighboring signal traces occur due to high electrical conductivity
Solution Approach 1:
The patent changes the material parameter from silicon to glass, fundamentally altering the electrical conductivity from high to low. This parameter change resolves the contradiction by maintaining interconnection functionality while eliminating substrate loss and signal interference, as glass provides the required electrical isolation properties.
Solution Approach 2:
The patent employs glass as a composite alternative to silicon interposers. The glass material combines low electrical conductivity with mechanical robustness and manufacturability, creating a composite solution that simultaneously addresses signal quality, loss reduction, and structural requirements.
2Reliability
If silicon interposers are used, then interconnection is achieved, but manufacturing costs increase
Solution Approach 1:
The patent substitutes expensive silicon interposers with cheaper glass-based interposer structures. The glass interposer with TGVs provides comparable or superior interconnection reliability at reduced manufacturing cost, aligning with the principle of using more economical materials when performance requirements are met.
3Loss of energy
If glass interposers with TGVs and SIW technology are used, then substrate loss is reduced and mechanical robustness is improved, but device complexity increases
Solution Approach 1:
The patent segments the interposer structure into distinct functional components: glass substrate, TGVs for electrical connection, and SIW structures for RF signal transmission. This segmentation allows each component to be optimized independently while maintaining overall system performance, managing complexity through modular design.
Data Source
AI summary
Various integrated high quality electronic components and systems, and methods of their manufacture, are presented. In one example, a device includes a glass substrate or interposer including one or more metalized through-glass vias (TGVs). The one or more metalized TGVs can be used to form a substrate integrated waveguide, a complementary split ring resonator, a disc loaded monopole antenna or other device. An array of metalized TGVs can define side walls of the integrated waveguide. A disc coupled to a tip of a metalized TGV can provide capacitive disc loading of the monopole antenna.