Thin Glass Resin Laminate Cutting to Prevent Bonding Air Bubbles
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Solution Overview
Problem
Laser processing of thin glass resin laminates with a pressure-sensitive adhesive layer often results in air bubbles when bonded to an adherend, which are difficult to remove and negatively impact product quality and yield.
Innovation Solution
A method involving laser processing of thin glass resin laminates with a specific thickness and creep characteristic of the pressure-sensitive adhesive layer, using different lasers for the glass and resin layers, and optimizing the adhesive layer's composition to prevent air bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser processing is used to cut thin glass resin laminate with pressure-sensitive adhesive layer, then cutting speed and end surface quality are improved, but air bubbles occur in the pressure-sensitive adhesive layer when bonded to adherend
Solution Approach 1:
The patent changes the physical-chemical parameters of the pressure-sensitive adhesive layer by controlling its thickness (1-10 μm) and creep characteristic (≥10 μm/Hr) to resolve the contradiction between cutting efficiency and bonding quality. These parameter adjustments allow the adhesive layer to properly expel air bubbles during bonding while maintaining the benefits of laser processing.
Solution Approach 2:
The patent applies preliminary action by pre-configuring the pressure-sensitive adhesive layer with specific thickness and creep characteristics before bonding occurs. This preliminary setup ensures that the adhesive layer has the necessary properties to prevent air bubble formation during the subsequent bonding process, resolving the contradiction between fast laser cutting and reliable bonding.
2Reliability
If the pressure-sensitive adhesive layer thickness is increased to prevent air bubbles, then bonding quality improves, but the laminate becomes thicker and less flexible
Solution Approach 1:
The patent optimizes the thickness parameter of the pressure-sensitive adhesive layer to a specific range (1-10 μm) that simultaneously achieves bonding quality improvement while maintaining laminate flexibility. This precise parameter control resolves the contradiction between preventing air bubbles and keeping the laminate thin.
Solution Approach 2:
The patent introduces the creep characteristic parameter (≥10 μm/Hr) that adds a time-dependent dynamic property to the adhesive layer. This dynamic property allows the thin adhesive layer to gradually flow and expel air bubbles during bonding, achieving both thinness and bonding quality without increasing overall laminate thickness.
3Reliability
If conventional cutting methods (e.g., end mill) are used instead of laser processing, then air bubbles are prevented, but cutting speed and productivity decrease
Solution Approach 1:
The patent changes the parameters of the pressure-sensitive adhesive layer (thickness and creep characteristic) to be compatible with laser processing, thereby maintaining high cutting speed while preventing air bubbles. This resolves the contradiction by making the adhesive layer itself adaptive to the laser cutting process rather than avoiding laser cutting altogether.
Solution Approach 2:
The patent creates a composite structure where the pressure-sensitive adhesive layer is specifically engineered with particular thickness and creep characteristics to work synergistically with laser processing. This composite approach allows the system to achieve both high productivity from laser cutting and reliable bonding without air bubbles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents air bubbles in the bonded laminate, enhancing the end surface quality and handleability of the thin glass resin laminate pieces.
Implementation Method 1
laser processing to cut the laminate
Implementation Method 2
irradiating a surface of the thin glass with laser light, and irradiating a surface of the resin layer with laser light
Data Source
Figure 1(a)~2
AI summary
Provided is a method of producing a thin glass resin laminate piece, which includes cutting a thin glass resin laminate through laser processing, and by which a thin glass resin laminate piece capable of preventing the occurrence of air bubbles when bonded to an adherend can be obtained. The method of producing a thin glass resin laminate piece of the present invention includes a step of subjecting a thin glass resin laminate including a thin glass, a resin layer, and a pressure-sensitive adhesive layer in the stated order to laser processing to cut the laminate, wherein a thickness (µm) of the pressure-sensitive adhesive layer and a creep characteristic (µm/Hr) of the pressure-sensitive adhesive layer have a relationship of (thickness (µm))2×creep characteristic (µm/Hr)≥50×103 (µm2·µm/Hr).