Low-Dielectric Glass Laminate for Stable High-Frequency Circuits
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Solution Overview
Problem
Multi-layer circuit boards for high-frequency communication require improved surface flatness, dimensional stability, and reduced transmission loss to support the increasing demands of sophisticated electronic devices, particularly in 5G systems.
Innovation Solution
A laminate comprising a glass sheet with low dielectric properties and a resin layer, where the glass sheet has a relative dielectric constant of 5 or less and a dielectric loss tangent of 0.003 or less at 2.45 GHz, is used as a core layer, enhancing thermal stability and reducing transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a resin layer obtained by impregnating glass cloth with resin is used as a core layer, then it provides basic structural support, but the surface smoothness and dimensional stability are insufficient
Solution Approach 1:
The patent uses a composite structure combining a glass sheet layer and a resin layer. The glass sheet provides excellent surface smoothness and dimensional stability, while the resin layer provides structural support and bonding. This composite material approach resolves the contradiction by combining materials with complementary properties to achieve both surface quality and dimensional stability required for high-frequency communication circuits.
2Ease of manufacture
If conventional resin layers are used, then manufacturing is easier, but transmission loss in high-frequency communication increases
Solution Approach 1:
The patent changes the dielectric parameters by introducing a glass sheet layer with specific dielectric properties (relative dielectric constant of 5 or less and dielectric loss tangent of 0.003 or less at 2.45 GHz). This parameter change significantly reduces transmission loss for high-frequency signals while maintaining manufacturability through standard lamination processes with resin layers.
3Loss of energy
If glass sheets with low dielectric properties are laminated with resin layers, then transmission loss is reduced, but the structure becomes more complex
Solution Approach 1:
The patent employs a composite material structure where a glass sheet layer is laminated with resin layers. This approach reduces transmission loss by incorporating the low-dielectric glass sheet while managing structural complexity through standard lamination techniques and optimized layer configurations, achieving a balance between performance improvement and manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate provides improved connection reliability, reduced positional deviation during circuit formation, and lower transmission loss, enabling high-density circuits suitable for high-frequency communication.
Implementation Method 1
a relative dielectric constant of the glass sheet at 25° C. and a frequency of 2.45 GHz being 5 or less, and a dielectric loss tangent of the glass sheet at 25° C. and a frequency of 2.45 GHz being 0.003 or less
Data Source
AI summary
A laminate according to an embodiment of the present invention includes at least one glass sheet and at least one resin layer, a relative dielectric constant of the glass sheet at 25° C. and a frequency of 2.45 GHz being 5 or less, and a dielectric loss tangent of the glass sheet at 25° C. and a frequency of 2.45 GHz being 0.003 or less.