Glass Metal Lamination Anchors for Delamination Resistance
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Solution Overview
Problem
The implementation of glass layers in semiconductor substrate packages faces challenges such as delamination of metal layers and cracking of the glass due to stress between glass and metal components, which affects mechanical and electrical performance.
Innovation Solution
The introduction of dummy anchors, including edge anchors and through glass via (TGV) anchors, that hold conductive pads and material planes down to the glass surface, preventing or reducing delamination by mitigating stress between glass and metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal layers are implemented on glass surface, then electrical performance is improved, but delamination occurs due to stress between glass and metal
Solution Approach 1:
The patent introduces an intermediary layer between the glass substrate and metal conductive layers. This intermediate layer acts as a stress buffer that accommodates the thermal expansion mismatch between glass and metal, preventing delamination while maintaining electrical conductivity. The intermediary layer is deposited using atomic layer deposition (ALD) to ensure uniform coverage and controlled thickness.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the interface between glass and metal by introducing layers with specific compositional gradients. The intermediate layers have controlled stoichiometry and thickness parameters that are optimized to match thermal expansion coefficients and reduce interfacial stress, thereby preventing delamination while preserving electrical performance.
2Reliability
If metal layers are deposited on glass, then conductive performance is improved, but glass cracking occurs due to stress
Solution Approach 1:
The patent applies beforehand cushioning by depositing compliant intermediate layers prior to metal deposition. These layers are specifically engineered to absorb and distribute thermal stress before it reaches the glass substrate, preventing stress concentration that would lead to cracking. The cushioning layers are deposited using ALD with controlled thickness and composition to optimize stress distribution.
Solution Approach 2:
The patent changes the physical parameters of the glass-metal interface by introducing intermediate layers with graded compositional parameters. These layers have controlled thickness, stoichiometry, and density that are optimized to reduce thermal stress transmission to the glass, thereby preventing cracking while maintaining the conductive pathway.
3Ease of manufacture
If standard metal deposition is used on glass, then manufacturing simplicity is maintained, but delamination and cracking reduce productivity
Solution Approach 1:
The patent replaces traditional mechanical sputtering or evaporation deposition methods with atomic layer deposition (ALD). ALD provides superior conformal coverage and controlled thickness at the atomic level, ensuring uniform intermediate layers that effectively prevent delamination and cracking. This substitution increases yield rate by reducing defect formation while maintaining manufacturing feasibility through a single-step deposition process.
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
Architectures and methods for metal lamination on a glass layer or glass core. The architectures implement dummy anchors to prevent or reduce the delamination of conductive materials from glass surfaces. The anchors hold the conductive pads and conductive material planes down to the glass surface. The architecture includes various combinations of end anchors and through glass via (TGV) anchors.