Glass-Layer Printed Circuit Board for Singulation Breakage Control
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Solution Overview
Problem
The use of glass materials in printed circuit boards (PCBs) is hindered by thermal/mechanical stability issues, leading to warpage and breakage, particularly during the singulation process, which affects the reliability and flatness of the PCBs.
Innovation Solution
A printed circuit board design incorporating a glass layer with a first insulating layer, a first interconnection layer, and a first protective layer, where the width of the insulating layer is narrower than the glass layer, and the protective layer has a higher thermal expansion coefficient than the insulating layer, minimizing stress and preventing crack formation during singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If glass materials are used in PCBs to achieve thermal/mechanical stability and overcome warpage problems, then warpage control is improved, but the glass layer becomes prone to breakage during the singulation process
Solution Approach 1:
The patent applies composite materials by combining glass materials with organic insulating layers and protective layers. The glass layer provides thermal and mechanical stability, while the organic layers and protective coatings compensate for the glass layer's brittleness, creating a composite structure that achieves both stability and breakage resistance during singulation.
Solution Approach 2:
The patent implements beforehand cushioning by applying protective layers and organic insulating layers before the glass layer undergoes singulation. These layers act as cushioning elements that absorb stress and prevent direct impact on the glass layer, thereby preventing breakage during the singulation process.
2Adaptability or versatility
If the width of the insulating layer is made smaller than the glass layer to improve design freedom, then design flexibility is improved, but stress concentration increases during singulation
Solution Approach 1:
The patent applies local quality by creating a non-uniform structure where the insulating layer width differs from the glass layer width. The protective layer is strategically positioned to cover specific areas where stress concentration occurs, providing localized reinforcement without compromising overall design freedom. This allows the insulating layer to be narrower for design flexibility while the protective layer addresses stress concentration at critical locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the flatness and reliability of the PCB by controlling warpage and protecting the glass layer from external impacts, ensuring high-density microcircuit formation and increased design freedom.
Implementation Method 1
the protective layer has a higher thermal expansion coefficient than the insulating layer, minimizing stress and preventing crack formation during singulation
Data Source
AI summary
A printed circuit board includes a glass layer, a first insulating layer disposed on the glass layer, a first interconnection layer disposed on the first insulating layer, and a first protective layer covering a portion of an upper surface of the glass layer, at least a portion of a side surface of the glass layer, and at least a portion of a side surface of the first insulating layer.