Multilayer Capacitor Glass Lead-In for Interface Moisture Blocking
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Solution Overview
Problem
The interface between the capacitance formation portion and the cover portion in multilayer ceramic capacitors is prone to moisture penetration, compromising moisture resistance reliability.
Innovation Solution
Incorporating a lead-in portion made of glass between the capacitance formation portion and the cover portion, which blocks the penetration path for external moisture, enhancing the interfacial bonding strength and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cover portions are disposed on the upper and lower parts of the capacitance formation portion to protect the internal electrodes, then the internal electrodes are protected, but moisture penetration at the interface between capacitance formation portion and cover portion increases
Solution Approach 1:
A lead-in portion extending from the internal electrode into the body is introduced as an intermediary structure between the capacitance formation portion and cover portion. This lead-in portion creates a stepped configuration that prevents direct contact between moisture and the interface, thereby blocking the moisture penetration path while maintaining electrode protection.
Solution Approach 2:
The lead-in portion extends in the depth direction (z-axis) from the internal electrode surface into the body, creating a three-dimensional stepped structure. This dimensional extension effectively blocks the two-dimensional interface between capacitance formation portion and cover portion, preventing moisture penetration along the original interface plane.
2Ease of manufacture
If the interface between capacitance formation portion and cover portion is simplified for manufacturing, then manufacturing ease improves, but interfacial bonding strength decreases
Solution Approach 1:
The interface region is segmented into multiple levels: the capacitance formation portion, the lead-in portion extending from the internal electrode, and the cover portion. This segmentation creates a stepped configuration that increases the effective bonding area and creates mechanical interlocking, thereby improving interfacial bonding strength without complicating the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the moisture resistance reliability of multilayer electronic components by effectively preventing moisture ingress, thereby maintaining the integrity and performance of the capacitors.
Implementation Method 1
Incorporating a lead-in portion made of glass between the capacitance formation portion and the cover portion, which blocks the penetration path for external moisture
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately stacked with the dielectric layer, and a cover portion disposed on both end surfaces of the capacitance formation portion in a stacking direction of the dielectric layer and the internal electrode, and an external electrode disposed on the body. When an area introduced inwardly from a surface of the body and including glass is defined as a lead-in portion, the lead-in portion is disposed between the capacitance formation portion and the cover portion.