Transparent Glass Mediator for UV Curing in Optical Butt Connections

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Solution Overview

Problem

Existing integrated optical devices face challenges in achieving stable butt connections between optical waveguides due to incomplete curing of UV curing adhesives, caused by light absorption in Si and InP substrates, leading to insufficient adhesive strength and alignment issues, which result in varying connection losses and reliability concerns.

Innovation Solution

A butt coupling method where a transparent glass substrate is used to transmit UV light to the bonding region, ensuring complete curing of the adhesive and stable alignment by forming a groove on the SiP chip to receive the glass substrate, allowing for flush processing of the connection end faces and efficient UV curing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If UV curing adhesive is used to bond PLC and SiP substrates, then bonding speed is improved, but adhesive curing is incomplete due to light absorption by Si and InP substrates

Engineering Contradiction:
Improvebonding speedVSAvoidadhesive curing completeness
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

A UV-transparent glass substrate is introduced as an intermediary component between the UV light source and the bonding region. This glass substrate transmits UV light through to the adhesive layer, enabling complete curing while maintaining the fast bonding speed advantage of UV curing adhesives.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If butt connection is used to connect waveguides, then alignment precision is improved, but connection stability deteriorates due to incomplete adhesive curing

Engineering Contradiction:
Improvealignment precisionVSAvoidconnection stability
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The UV-transparent glass substrate serves as a mediator that enables complete UV light transmission to the adhesive, ensuring stable and reliable butt connections between waveguides while maintaining the precision of the alignment process.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If UV curing adhesive is used for bonding, then bonding efficiency is improved, but connection loss variation increases due to insufficient adhesive strength

Engineering Contradiction:
Improvebonding efficiencyVSAvoidconnection loss consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The glass substrate acts as a UV light transmission intermediary that ensures complete adhesive curing throughout the bonding region, resulting in consistent adhesive strength and reduced connection loss variation while maintaining high bonding efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables stable optical coupling with reduced loss variation and improved long-term reliability by ensuring complete adhesive curing and precise alignment of the optical waveguides, enhancing the integration of optical circuits and function elements.

Implementation Method 1

a transparent glass substrate is used to transmit UV light to the bonding region

Methodology Applied
Scientific EffectUV light transmission: Absorption (EM radiation)

Implementation Method 2

the connection end face of the optical circuit and an end face of the butt coupling holding substrate are processed to be flush with each other, and the optical circuit and the optical function element are fixed by a UV curing adhesive filling the connection end face being cured by UV light transmitted through the butt coupling holding substrate

Methodology Applied
Scientific EffectUV curing: Photopolymerisation

Data Source

PatentUS20240219639A1Integrated Optical Device and Manufacturing Method Thereof
Publication Date: 2024.07.04 NT T INC
  • US20240219639A1 patent drawing
  • US20240219639A1 patent drawing
  • US20240219639A1 patent drawing

AI summary

An integrated optical device capable of easily connecting waveguides and achieving stable optical coupling is provided. In the integrated optical device in which an optical circuit that is provided on a substrate that does not transmit light from an ultraviolet range to a visible range and performs optical signal processing and an optical function element made of a material that does not transmit light in the ranges are butt-connected, in the optical circuit, a butt coupling holding substrate that transmits light in the ranges is mounted in a groove that reaches a connection end face where an input/output waveguide is formed, the connection end face of the optical circuit and an end face of the butt coupling holding substrate are processed to be flush with each other, and the optical circuit and the optical function element are fixed by a UV curing adhesive filling the connection end face.