Photodefinable Glass Multichip Package for Light Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current packaging solutions for sensors and electronic components are complex, costly, and lack reliable integration, with significant tooling expenses and marginal reliability, as well as inadequate light isolation between sensors and electrical components in multichip optical sensor packages.
Innovation Solution
The development of a glass-based multichip package using a photodefinable glass substrate that is exposed to ultraviolet light to form ceramic portions, allowing for the integration of electronic components such as optical sensors and light sources, with features like lenses, cavities, and through-glass vias, and the use of ceramic for light isolation and interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging solutions are used for sensors and electronic components, then the packaging process can be completed, but the complexity of the packaging structure increases and tooling costs increase
Solution Approach 1:
The patent combines multiple packaging functions into a single glass substrate that serves as both the mounting platform and the light isolation barrier. The glass substrate integrates mechanical support, electrical isolation, and optical isolation functions that traditionally required separate components, thereby reducing overall packaging complexity while maintaining reliability.
Solution Approach 2:
The glass substrate is designed to perform multiple functions simultaneously: it provides mechanical support for electronic components, acts as an electrical insulator, and serves as a light isolation barrier through its ceramic-converted portions. This multi-functionality eliminates the need for separate isolation structures and reduces tooling requirements.
2Reliability
If traditional packaging solutions are used for sensors and electronic components, then the packaging process can be completed, but tooling costs increase significantly
Solution Approach 1:
The patent employs a disposable photomask layer that is applied to the glass substrate, exposed to UV light through a patterned aperture, and then removed after serving its purpose. This approach eliminates the need for expensive, reusable precision tooling while achieving the same light isolation effect, significantly reducing tooling costs.
Solution Approach 2:
The patent changes the physical and chemical parameters of the glass substrate by exposing it to UV light through a photomask, which converts specific regions from glass to ceramic state. This parameter change creates the light isolation barrier without requiring complex mechanical structures or expensive tooling, simplifying the manufacturing process.
3Adaptability or versatility
If multichip optical sensor packages are assembled, then sensors and electrical components can be integrated, but light isolation between sensors and electrical components becomes inadequate
Solution Approach 1:
The patent applies local quality changes by converting only specific portions of the glass substrate to ceramic through selective UV exposure. The ceramic portions provide light isolation where needed, while the remaining glass portions maintain optical transparency for sensor operation. This localized property change achieves light isolation without compromising sensor functionality.
Solution Approach 2:
The patent creates a composite structure where glass and ceramic phases coexist within the same substrate. The glass portions provide optical transparency and mechanical support, while the ceramic portions provide light isolation. This composite approach enables simultaneous achievement of component integration and light isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the packaging process, reduces tooling costs, enhances reliability, and provides effective light isolation, facilitating the integration of sensors and electronic components while maintaining thermal stability and optical transparency.
Implementation Method 1
a photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic
Data Source
AI summary
In implementations, a glass-based multichip package includes a photodefinable glass-based substrate, at least one electronic component disposed on the photodefinable glass-based substrate, and a portion of the photodefinable glass-based substrate that has been exposed to ultraviolet light, where the portion of the photodefinable glass-based substrate includes ceramic. Additionally, the sensor package may include additional electronic components, a glass touch panel, and/or a printed circuit board. In implementations, fabricating the sensor package device includes receiving a photodefinable glass-based substrate, etching the photodefinable glass-based substrate, and forming a ceramic portion of the photodefinable glass-based substrate.