Glass-Semiconductor Optical Interconnect Assembly for Photonic IC Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor manufacturing technologies face challenges in integrating photonic components with electronic ICs, as silicon-based materials dominate and lack efficient methods for optical interconnects.
Innovation Solution
Integration of glass wafers with semiconductor structures using optical interconnects, where glass wafers are bonded with semiconductor wafers, allowing for the integration of photonic components with electronic ICs on a single substrate, utilizing materials like aluminum oxide, aluminum nitride, or hexagonal crystal structures for optical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon-based materials are used for semiconductor structures, then manufacturing compatibility and existing infrastructure are maintained, but optical interconnect efficiency and photonic component integration are insufficient
Solution Approach 1:
The patent employs a composite substrate structure combining glass wafer and semiconductor wafer bonded together. The glass wafer provides excellent optical transparency and photonic component compatibility, while the semiconductor wafer maintains manufacturing infrastructure compatibility. This composite material approach resolves the contradiction by integrating materials with complementary properties to simultaneously achieve optical efficiency and manufacturing adaptability.
Solution Approach 2:
The glass wafer serves multiple functions: it acts as a substrate for photonic components, provides optical transmission paths, and enables mechanical support. This multi-functional design allows the system to integrate both photonic and electronic components on a single assembly, resolving the versatility limitation of traditional silicon-only structures while maintaining manufacturing compatibility through the bonded semiconductor wafer interface.
2Adaptability or versatility
If glass wafers are bonded with semiconductor wafers, then photonic and electronic components are integrated on a single substrate, but manufacturing process complexity increases
Solution Approach 1:
The patent divides the integrated assembly into distinct segments: a glass wafer portion and a semiconductor wafer portion, which are separately processed and then bonded together. This segmentation allows each material to be manufactured using its optimal process infrastructure, reducing overall manufacturing complexity while achieving integrated photonic-electronic functionality on a single assembled substrate.
Solution Approach 2:
The bonding interface between glass and semiconductor wafers acts as an intermediary that connects two different material systems. By developing specialized bonding processes for this interface, the patent enables integration of photonic components on glass with electronic components on semiconductor, achieving versatility without requiring complete process retooling for both materials simultaneously.
3Use of energy by moving object
If optical interconnects are implemented through openings in semiconductor structures, then optical signal transmission is enabled, but mechanical alignment precision and structural stability may be compromised
Solution Approach 1:
The glass wafer provides a structurally stable platform with excellent mechanical properties that supports precise optical element placement. When bonded to the semiconductor wafer, this composite structure maintains structural integrity while enabling optical interconnects, resolving the contradiction between optical transmission capability and mechanical alignment stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the integration of photonic components with electronic circuits, providing efficient optical interconnects and mechanical support, enhancing the functionality and alignment of optical elements in microelectronic assemblies.
Implementation Method 1
the second face of the glass structure is bonded with the first face of the semiconductor structure
Implementation Method 2
glass wafers are typically highly transparent to light across a wide range of wavelengths, allowing optical signals to pass through with minimal absorption or scattering
Data Source
AI summary
Disclosed herein are microelectronic assemblies having glass structures integrated with semiconductor structures with optical interconnects. An example microelectronic assembly includes a glass structure having a first face and an opposite second face, and a semiconductor structure having a first face and an opposite second face. The first face of the glass structure is further away from the semiconductor structure than the second face of the glass structure, the second face of the glass structure is bonded with the first face of the semiconductor structure, and the semiconductor structure includes an opening extending between the first face of the semiconductor structure and the second face of the semiconductor structure. The microelectronic assembly further includes an optical interconnect in the opening, where the optical interconnect includes a glass material, a material that either includes aluminum and oxygen or includes aluminum and nitrogen, or a material having a hexagonal crystal structure.