Laser-Bonded Glass Package With Barrier Layers for Low Permeation
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Solution Overview
Problem
Existing packages used to protect sensitive electronics and components from adverse environmental conditions suffer from gas or fluid permeability issues, leading to potential contamination or leakage, which is particularly problematic for long-lasting applications like medical implants or high-temperature environments.
Innovation Solution
A multi-layered glass package with a base substrate, cover substrate, and optional intermediate substrate, utilizing laser welding and a barrier layer to reduce permeability, and optionally including a second barrier layer to enhance protection, with materials like silicon-based oxides and nitrides or aluminum-based oxides and nitrides to create a hermetic seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a simple glass package structure is used, then manufacturing ease and cost are improved, but permeability increases leading to contamination and leakage
Solution Approach 1:
The patent applies composite materials by combining glass substrates with deposited barrier layers (such as silicon oxide, silicon nitride, or aluminum oxide). This composite structure maintains the hermetic sealing and protective properties of glass while adding enhanced permeability resistance through the deposited layers, directly resolving the contradiction between manufacturing simplicity and permeability resistance.
Solution Approach 2:
The patent changes the physical and chemical parameters of the glass surface by depositing thin films of barrier materials. This modifies the surface properties to reduce permeability without fundamentally changing the glass package structure, allowing maintenance of manufacturing ease while improving reliability against contamination and leakage.
2Reliability
If barrier layers are deposited to reduce permeability, then reliability is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent modifies surface parameters through thin-film deposition, achieving enhanced permeability resistance with minimal structural complexity. The barrier layers are applied as thin coatings rather than thick structural layers, maintaining relative simplicity while improving reliability.
Solution Approach 2:
By creating a composite structure of glass and deposited barrier layers, the patent achieves high reliability with controlled complexity. The combination of materials provides synergistic effects where the glass provides structural integrity and the deposited layers provide permeability resistance.
3Duration of action of stationary object
If glass materials are used for long-term protection, then durability is improved, but permeability over time allows substance penetration
Solution Approach 1:
The patent combines glass with deposited barrier layers to create a composite structure that extends service life while preventing substance penetration. The glass provides long-term structural stability and the deposited layers provide enhanced chemical resistance and permeability barriers, together resolving the contradiction between durability and protection against harmful factors.
Solution Approach 2:
The deposited barrier layers change the surface parameters of the glass to reduce permeability, maintaining the long service life of glass while preventing substance penetration over time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces permeability by at least 30% and ensures a longer service life for components by preventing gas or fluid exchange, maintaining the integrity of the package under harsh conditions.
Implementation Method 1
the materials used to form a package exhibit non-zero permeability. Thus, gases or liquids enclosed in the cavity can escape to the outside of the package, or such substances or fluids from the environment can penetrate into the package.
Implementation Method 2
utilizing laser welding and a barrier layer to reduce permeability
Data Source
AI summary
A package for encapsulating a functional area against an environment includes a base substrate and a cover substrate, the base substrate together with the cover substrate defining at least part of the package or defining the package, and furthermore including the at least one functional area provided in the package, and a blocking way for reducing permeation between the environment and the functional area. The package may include at least one laser bonding line, and the substrates of the package can be hermetically joined to one another by the at least one laser bonding line, and the laser bonding line has a height (HL) perpendicular to its bonding plane.