Glass IC Package Substrate Cooling With Isolated Microchannels
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Solution Overview
Problem
Traditional cooling systems for integrated circuit (IC) packages, such as heatsinks and liquid cooling systems, often provide single-sided cooling, which can lead to inefficiencies in heat transfer and potential overheating of electronic components.
Innovation Solution
The implementation of a glass core with a micro-channel in the package substrate that receives a cooling fluid, allowing for double-sided cooling by isolating the channel from vias and optimizing channel geometry for enhanced heat transfer, such as varying passage spacing and cross-sectional width, to improve cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional single-sided cooling systems (heatsinks or liquid cooling) are used for IC packages, then the cooling system is simple to implement, but heat transfer efficiency is insufficient and electronic components may overheat
Solution Approach 1:
The patent transitions from single-sided cooling to double-sided cooling by adding cooling channels on both the top and bottom surfaces of the glass substrate. This dimensional expansion allows heat to be dissipated from both sides of the IC package simultaneously, significantly improving heat transfer efficiency without simply increasing the complexity of a single-sided system
Solution Approach 2:
The cooling system is segmented into multiple independent cooling channels distributed across both surfaces of the glass substrate. Each channel can be independently designed and optimized for specific heat dissipation zones, allowing targeted cooling of different regions of the IC package while maintaining overall system efficiency
2Loss of energy
If cooling channels are added to the glass substrate for double-sided cooling, then cooling efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes manufacturing by controlling key parameters of the glass substrate and cooling channels, including substrate thickness (0.5-5mm), channel dimensions, and material composition. By establishing specific parameter ranges, the patent enables double-sided cooling while maintaining compatibility with existing glass fabrication processes and ensuring manufacturability
Solution Approach 2:
The glass substrate serves multiple functions simultaneously: it acts as a mechanical support structure, an electrical insulator, and a thermal management component with integrated cooling channels. This multi-functionality reduces the need for separate cooling components and simplifies the overall manufacturing process by combining structural and thermal management functions in a single element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cooling efficiency by enabling effective heat transfer from both sides of the IC package, preventing overheating and improving the operation of electronic devices.
Implementation Method 1
the channel to receive a cooling fluid to flow through the channel... heat transfer from one or more electronic components of the IC package to the cooling fluid, thus reducing a temperature of the electronic components
Data Source
AI summary
Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substrates are disclosed. An example glass core of an integrated circuit (IC) package disclosed herein includes a fluid inlet to receive a cooling fluid, a fluid outlet, and a channel to fluidly couple the fluid inlet to the fluid outlet, the cooling fluid to flow through the channel from the fluid inlet to the fluid outlet, the channel fluidly isolated from one or more vias extending between a first surface and a second surface of the glass core.