Glass Substrate Packaging With Optical Waveguides for Long Signal Paths

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Solution Overview

Problem

The increasing size of circuit substrates leads to longer electrical paths for signal transmission, affecting transmission efficiency.

Innovation Solution

A package structure utilizing a glass substrate with integrated optical waveguides and through-substrate-vias, along with redistribution structures and optical conductive vias, to enhance signal transmission efficiency by incorporating photonic chips that convert electrical signals to photonic signals for long-range communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the circuit substrate size is increased to package various devices for multi-functions and applications, then the packaging capacity and functionality are improved, but the electrical paths for signal transmission become longer and transmission efficiency deteriorates

Engineering Contradiction:

Improvepackaging capacityVSAvoidtransmission efficiency

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The patent replaces electrical signal transmission through traditional conductive paths with optical signal transmission through waveguides. This substitution of transmission mechanism fundamentally resolves the contradiction by enabling long-range signal transmission without the energy loss and path length limitations inherent in electrical systems. The waveguide-based optical transmission allows large substrate sizes to be used while maintaining high transmission efficiency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If traditional electrical signal transmission is used in large-sized substrates, then the manufacturing process is simple, but the transmission efficiency and power efficiency deteriorate due to longer electrical paths

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidtransmission efficiency

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent substitutes electrical transmission infrastructure with optical transmission infrastructure using waveguides. This replacement enables efficient signal transmission across large distances while the integration process maintains manufacturing feasibility through established semiconductor fabrication techniques adapted for waveguide formation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The waveguide structure serves multiple functions: it acts as both an optical transmission medium and an integrated component within the semiconductor device architecture. This multi-functionality allows the same structural element to address both transmission efficiency requirements and manufacturing integration needs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If electrical paths are extended to accommodate larger substrate sizes, then the packaging versatility is improved, but the signal transmission efficiency and power consumption are adversely affected

Engineering Contradiction:

Improvepackaging versatilityVSAvoidsignal transmission efficiency

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent replaces the electrical signal transmission system with an optical signal transmission system using waveguides. This substitution eliminates the fundamental limitations of electrical transmission over long distances, including signal attenuation, interference, and power consumption, thereby maintaining high transmission efficiency and reliability across large substrate sizes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves transmission efficiency and power efficiency by minimizing signal loss and reducing electrical path lengths through the use of optical waveguides and photonic chips.

Implementation Method 1

a first optical waveguide; to enhance signal transmission efficiency by incorporating photonic chips that convert electrical signals to photonic signals

Methodology Applied

Scientific EffectOptical waveguide transmission: Waveguide (optics)

Implementation Method 2

a glass substrate including an optical waveguide

Methodology Applied

Scientific EffectMechanical support:

Data Source

PatentUS20250316599A1Package structure and manufacturing method thereof

Publication Date: 2025.10.09 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure and a manufacturing method thereof are provided. The package includes a glass substrate, a through-substrate-via and a redistribution structure. The glass substrate includes a first optical waveguide. The through-substrate-via penetrates through the glass substrate. The redistribution structure is disposed on the glass substrate and electrically connected to the through-substrate-via.