Glass Packaging Substrate Edge Exposure for Defect Detection
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently detecting defects on glass substrates, particularly in reducing time and cost associated with inspecting the glass substrate's quality, including surface and cross-sectional defects.
Innovation Solution
A packaging substrate design featuring a glass substrate with an edge region that protrudes from the upper or lower layers, allowing for easy detection of defects without the need for expensive inspection equipment. The manufacturing method involves forming an upper and/or lower layer on the glass substrate, removing these layers by a predetermined width, and using laser filamentation to separate the glass substrate, facilitating defect detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If expensive inspection equipment is used to detect defects on glass substrate, then measurement precision is improved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the inspection function from complex external equipment and integrates it into the substrate structure itself. The edge region protruding from the upper/lower layers serves as an built-in inspection feature that allows direct visual or optical inspection without requiring sophisticated external检测设备, thereby reducing device complexity while maintaining defect detection capability
Solution Approach 2:
The substrate structure provides its own inspection capability through the edge region design. The protruding edge naturally exposes the interface between glass substrate and layers, creating a self-inspecting feature that eliminates the need for separate complex inspection systems, thus reducing both equipment complexity and cost
2Measurement precision
If comprehensive inspection of glass substrate surface and cross-section is performed, then measurement precision is improved, but loss of time increases
Solution Approach 1:
The patent merges surface inspection and cross-sectional inspection into a single unified inspection process. The edge region protruding from the layers simultaneously exposes both the surface interface and the cross-sectional interface, allowing inspectors to check both aspects in one operation rather than requiring separate inspection steps, thereby reducing inspection time while maintaining comprehensive defect detection
Solution Approach 2:
The patent adds a dimensional aspect to the inspection capability by creating a protruding edge region that extends beyond the planar layers. This third-dimensional exposure allows light and inspection tools to access both surface and cross-sectional features simultaneously, enabling comprehensive inspection in a single operation and reducing the time required
3Ease of operation
If upper and lower layers are removed by predetermined width to create edge region, then ease of operation for inspection is improved, but loss of substance increases
Solution Approach 1:
The patent applies partial removal of the upper and lower layers only at the peripheral edge regions rather than removing entire layers or using excessive material removal. This selective partial removal creates just enough exposure of the edge region to enable effective inspection while minimizing the total amount of material lost, thus achieving a balance between inspection ease and material conservation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables quick and accurate detection of defects on the glass substrate, reducing inspection time and costs while simultaneously inspecting the surface and cross-section, thereby improving the efficiency of semiconductor packaging substrate manufacturing.
Implementation Method 1
a forming operation of a filamentation along a cutting line on the glass substrate from which the upper layer has been removed; and a cutting operation of the glass substrate using the filamentation
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
Embodiments relate to packaging substrates and methods of manufacturing the same. A substrate with embedded elements according to the embodiments comprises a glass substrate comprising a first surface and a second surface facing each other; and an upper layer stacked on the first surface, or a lower layer stacked on the second surface; wherein the glass substrate may have an edge region that protrudes from the upper layer or the lower layer. A manufacturing method of a packaging substrate, comprises a forming operation of an upper layer on a first surface of a glass substrate comprising the first surface and a second surface facing each other; a removing operation of the upper layer by a predetermined width along a predetermined cutting line; a forming operation of a filamentation along the cutting line on the glass substrate from which the upper layer has been removed; and a cutting operation of the glass substrate using the filamentation. Through this, defects occurring on the surface and cross section of the substrate can be easily detected.