Glass Pane Connection Element Using Iron-Nickel Alloy
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Solution Overview
Problem
Mechanical stresses in glass panes due to thermal expansion coefficient differences between materials used in electrical connection elements and glass substrates, leading to potential breakage, especially with the need to replace lead-containing solders with lead-free alternatives.
Innovation Solution
A disk with a glass substrate and an electrically conductive structure connected via a lead-free solder layer, where the connection element is made of an iron-nickel or iron-nickel-cobalt alloy with a curvature and a solder mass distribution that minimizes mechanical stresses by controlling the solder mass exit width and using materials like silver and bismuth in the solder composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead-containing solders are used to connect electrical connection elements to glass panes, then mechanical stresses are compensated through plastic deformation, but environmental regulations require replacement with lead-free solders
Solution Approach 1:
The invention changes the material parameters by using iron-nickel or iron-nickel-cobalt alloys with specific thermal expansion coefficients (≤4×10⁻⁶/K) that match the glass substrate, and controls solder layer thickness (5-50 μm) and contact surface geometry (no corners, radius ≥0.5 mm) to achieve stress compensation without lead
Solution Approach 2:
The invention uses composite material structures including multiple layers (electrically conductive structure with silver particles and glass frits, connection element, solder layer) with different properties that work together to compensate thermal stresses while maintaining electrical conductivity and mechanical stability
2Reliability
If solder mass is transferred from the space between connection element and electrically conductive structure, then connection is formed, but large solder mass transfer creates critical mechanical stresses in the glass pane
Solution Approach 1:
The invention controls the solder mass transfer by limiting the exit width to less than 0.5 mm and optimizing solder layer thickness to 5-50 μm, which reduces the volume and distribution of solder mass that could create mechanical stresses while ensuring adequate electrical connection
Solution Approach 2:
The invention designs the contact surface without corners with a radius of curvature of at least 0.5 mm, which distributes stresses more evenly and prevents stress concentration points that would occur with sharp edges during solder mass transfer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces mechanical stresses in the glass panes, ensuring stability and preventing breakage across a range of temperatures, while adhering to environmental regulations by using lead-free materials.
Implementation Method 1
a layer of a lead-free solder that electrically connects the connection element to a portion of the electrically conductive structure
Implementation Method 2
Due to different thermal expansion coefficients of the materials used, mechanical stresses occur during production and operation
Data Source
AI summary
The invention relates to a disc with an electrical connection element, comprising: - a substrate consisting of glass (1), - an electrically conductive structure (2) with a layer thickness of between 5 µm and 40 µm on a region of said substrate (1), - a connection element (3) and - a layer of a soldering material (4) which electrically connects the connection element (3) to a sub-region (12) of the electrically conductive structure (2), - the connection element (3) containing at least one iron-nickel alloy or one iron-nickel-cobalt alloy, - the connection element (3) being connected over its entire surface to the sub-region (12) of the electrically conductive structure (2) by means of a contact surface (11), and - said contact surface (11) having no corners.