Glass Panel Cutting With Bessel Beam Positioning Against Reflection Damage
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Solution Overview
Problem
The cutting process of glass panels using laser beams can damage the glass substrate due to reflection from the display layer, leading to quality deterioration and potential unusability of the panels.
Innovation Solution
A method involving the formation of a deformed portion inside the glass substrate using a Bessel beam along a planned processing line, followed by etching from the opposite surface, where the Bessel beam irradiation is positioned with half or more of its length on the glass substrate side relative to the interface with the display layer to prevent damage from reflected beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam is used to cut the glass panel, then the cutting process can be performed efficiently, but the laser beam may be reflected by the display layer and focused on the glass substrate, causing damage and quality deterioration
Solution Approach 1:
The patent converts the harmful reflected laser beam into a beneficial tool by using it to form a deformed portion inside the glass substrate that facilitates controlled breaking. The reflection, which was previously damaging, is now utilized to create a predetermined weak point that guides the break along the desired cutting line, eliminating the need to avoid the display layer entirely.
Solution Approach 2:
The patent applies preliminary action by first forming a deformed portion inside the glass substrate at the intended cutting location before the actual breaking occurs. This deformed portion serves as a predetermined weak point that ensures the glass will break along the exact desired line when stress is applied, preventing unwanted shattering or deviation from the cutting path.
2Manufacturing precision
If the laser beam is focused precisely to achieve accurate cutting, then the cutting precision is improved, but the focused reflected beam can cause localized damage to the glass substrate
Solution Approach 1:
The patent transforms the potentially damaging focused reflected beam into a useful tool for creating the deformed portion. By controlling the focus point and energy distribution, the reflected beam's concentrated energy is used to modify the glass structure in a controlled manner, creating a predictable weak point rather than random damage.
3Reliability
If the Bessel beam length is increased to ensure full coverage on the glass substrate side, then the protection from reflection is improved, but the complexity of beam positioning and control increases
Solution Approach 1:
The patent employs parameter changes by adjusting the Bessel beam's length and positioning parameters to optimize the formation of the deformed portion. By carefully controlling these parameters, the system achieves reliable protection from reflection damage while maintaining manageable beam positioning requirements through systematic parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise cutting of glass panels without adverse effects on quality, ensuring the formation of deformed portions of exact desired lengths and enabling efficient etching to achieve the desired thickness, thus preventing damage from laser beam reflections.
Implementation Method 1
a deformed portion is formed inside the glass substrate through irradiation with a Bessel beam along a planned processing line on the glass substrate
Implementation Method 2
The laser beam falling on the display layer can be reflected by the display layer
Implementation Method 3
the deformed portion is removed by etching the glass substrate in a direction from the other surface of the glass substrate to the one surface of the glass substrate
Data Source
AI summary
A method of processing a glass panel including a glass substrate and a display layer disposed on one surface of the glass substrate to display an image, includes: a deformed portion formation step in which, in order to process the glass substrate, a deformed portion is formed inside the glass substrate through irradiation with a Bessel beam along a planned processing line on the glass substrate; and an etching step in which the deformed portion is removed by etching the glass substrate in a direction from the other surface of the glass substrate to the one surface of the glass substrate, wherein, in the deformed portion formation step, irradiation with the Bessel beam is performed with half or more of the overall length of the Bessel beam positioned on the side of the glass substrate with respect to an interface between the glass substrate and the display layer.